A simplified method of measuring three-dimensional thermal conductivity anisotropy has been developed around the popular 3ω method. This approach utilizes a pair of surface mounted test elements as both heating and sensing probes. 3ω has historically been used to measure thermal conductivity in homogeneous, low conductivity substrates and thin surface films. The present technique employs a combination of broad band frequency measurements and directionally oriented test elements to extract property information that was previously inaccessible. Data reduction is dramatically improved through the use of a full accuracy analytical solution that replaces the heavily approximated original 3ω solution. Anisotropic degrees of freedom are optimized using an efficient gradient based algorithm that can be coded using any number of commercially available software packages. Test element design guidelines are presented to help insure that optimal experimental conditions exist during material testing. Comparative experimental results are presented for an aligned graphite fiber / epoxy composite.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4731-4
PROCEEDINGS PAPER
Extending the 3 Omega Method to Measure Thermal Conductivity Anisotropy in Three Dimensions
Brandon Olson,
Brandon Olson
University of Oklahoma, Norman, OK
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Samuel Graham
Samuel Graham
Georgia Institute of Technology, Atlanta, GA
Search for other works by this author on:
Brandon Olson
University of Oklahoma, Norman, OK
Samuel Graham
Georgia Institute of Technology, Atlanta, GA
Paper No:
HT2005-72509, pp. 29-35; 7 pages
Published Online:
March 9, 2009
Citation
Olson, B, & Graham, S. "Extending the 3 Omega Method to Measure Thermal Conductivity Anisotropy in Three Dimensions." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 1. San Francisco, California, USA. July 17–22, 2005. pp. 29-35. ASME. https://doi.org/10.1115/HT2005-72509
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