Heat and mass transfer, particularly water transport was investigated at pore scale in unconsolidated porous media with a thermal probe as a heater. A CCD camera combined with a microscope was employed to observe and record water morphology variation during heating. The water near the heater firstly evaporated and then diffused to the region relatively far away where it condensed. As local temperature increased, the water would evaporate again and diffuse to even farther region. Even though the temperature and ambient conditions were the same, it could be induced that the liquid might have different chemical potentials with different interface curvatures. The chemical potential relationship between liquid and its surrounding vapor determined the phase change direction. At certain conditions, liquid evaporation and vapor condensation can coexist at the same region.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4731-4
PROCEEDINGS PAPER
Water Transportation in Porous Media at Pore Scale
Mingzhi Yu,
Mingzhi Yu
Tsinghua University, Beijing, China
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Xiaofeng Peng,
Xiaofeng Peng
Tsinghua University, Beijing, China
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Zhaohong Fang
Zhaohong Fang
Shandong Institute of Architecture and Engineering, Jinan, China
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Mingzhi Yu
Tsinghua University, Beijing, China
Xiaofeng Peng
Tsinghua University, Beijing, China
Zhaohong Fang
Shandong Institute of Architecture and Engineering, Jinan, China
Paper No:
HT2005-72613, pp. 181-185; 5 pages
Published Online:
March 9, 2009
Citation
Yu, M, Peng, X, & Fang, Z. "Water Transportation in Porous Media at Pore Scale." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 1. San Francisco, California, USA. July 17–22, 2005. pp. 181-185. ASME. https://doi.org/10.1115/HT2005-72613
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