The plane, steady, laminar wall jet with a uniform velocity and temperature profiles at the jet exit is numerically investigated using a two-dimensional finite volume approach for a variety of Reynolds numbers and Prandtl number of 0.712 and 7. Between the jet exit and the downstream self-similar behavior, the flow exhibits a developing region that is not self-similar. The location of the dimensionless virtual origin is carefully investigated and expressed as a function of Reynolds number. The local skin friction coefficient is observed to converge to the analytical self-similar solution at downstream locations. Since no analytical solution exists for the temperature field in either the developing or self-similar regions of this problem, the thermal solution is investigated for both isothermal and isoflux boundary conditions at the wall. The local and overall skin friction coefficients, in addition to the local and overall Nusselt numbers, are reported as a function of Reynolds number, Prandtl number and the dimensionless location downstream of the jet exit.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4731-4
PROCEEDINGS PAPER
The Skin Friction and Heat Transfer in a Laminar Plane Wall Jet That Evolves From a Uniform Velocity to Its Self-Similar Behavior
Johnny Issa,
Johnny Issa
University of Arizona, Tucson, AZ
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Alfonso Ortega
Alfonso Ortega
University of Arizona, Tucson, AZ
Search for other works by this author on:
Johnny Issa
University of Arizona, Tucson, AZ
Alfonso Ortega
University of Arizona, Tucson, AZ
Paper No:
HT2005-72034, pp. 123-130; 8 pages
Published Online:
March 9, 2009
Citation
Issa, J, & Ortega, A. "The Skin Friction and Heat Transfer in a Laminar Plane Wall Jet That Evolves From a Uniform Velocity to Its Self-Similar Behavior." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 1. San Francisco, California, USA. July 17–22, 2005. pp. 123-130. ASME. https://doi.org/10.1115/HT2005-72034
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