In this manuscript a systematic multidisciplinary electronic packaging design and optimization methodology based on the artificial neural networks technique is presented. This method is applied to a Ball Grid Array (BGA) package design as an example. Multidisciplinary criteria including thermal, structural (thermal strain), electromagnetic leakage, and cost are optimized simultaneously. A simplified routability criterion is also considered as a constraint. The artificial neural networks technique is used for thermal and structural performance predictions. Large calculation time reduction is achieved using the artificial neural networks, which also provide enough information to specify the individual weights for each design discipline within the objective function used for optimization. This methodology is able to provide the designers a clear view of the design trade-offs, which are represented in the objective function using various design parameters. This methodology can be applied to any electronic product design at any packaging level.
A Multidisciplinary Design and Optimization Methodology in Electronics Packaging: Application to BGA Design
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Hadim, H, & Suwa, T. "A Multidisciplinary Design and Optimization Methodology in Electronics Packaging: Application to BGA Design." Proceedings of the ASME 2003 Heat Transfer Summer Conference. Heat Transfer: Volume 3. Las Vegas, Nevada, USA. July 21–23, 2003. pp. 557-564. ASME. https://doi.org/10.1115/HT2003-47524
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