A stable numerical procedure is developed to analyze the transient performance of flat heat pipes for large input heat fluxes and high wick conductivity. Computation of flow and heat transfer in a heat pipe is complicated by the strong coupling among the velocity, pressure and temperature fields with phase change at the interface between the vapor and wick. A structured collocated finite volume scheme is used in conjunction with the SIMPLE algorithm to solve the continuity, energy and momentum equations. In addition, system pressurization is computed using overall mass balance. The stability of the standard sequential procedure is improved by accounting for the coupling between the evaporator/condenser mass flow rate and the interface temperature and pressure as well as the system pressure. The improved numerical scheme is applied to a flat two-dimensional heat pipe and shown to perform well. Parametric studies are performed by varying the vapor core thickness of the heat pipe and the heat input at the evaporator. The model predictions are validated by comparing the heat pipe wall temperatures against experimental values.
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ASME 2003 Heat Transfer Summer Conference
July 21–23, 2003
Las Vegas, Nevada, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-3695-9
PROCEEDINGS PAPER
Transient Analysis of Flat Heat Pipes
Unnikrishnan Vadakkan,
Unnikrishnan Vadakkan
Purdue University, West Lafayette, IN
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Jayathi Y. Murthy,
Jayathi Y. Murthy
Purdue University, West Lafayette, IN
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Suresh V. Garimella
Suresh V. Garimella
Purdue University, West Lafayette, IN
Search for other works by this author on:
Unnikrishnan Vadakkan
Purdue University, West Lafayette, IN
Jayathi Y. Murthy
Purdue University, West Lafayette, IN
Suresh V. Garimella
Purdue University, West Lafayette, IN
Paper No:
HT2003-47349, pp. 507-517; 11 pages
Published Online:
December 17, 2008
Citation
Vadakkan, U, Murthy, JY, & Garimella, SV. "Transient Analysis of Flat Heat Pipes." Proceedings of the ASME 2003 Heat Transfer Summer Conference. Heat Transfer: Volume 3. Las Vegas, Nevada, USA. July 21–23, 2003. pp. 507-517. ASME. https://doi.org/10.1115/HT2003-47349
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