Impinging jet is widely used in both traditional industrial and new high-tech fields. High efficiency heat transfer in impinging jet cooling makes it an important method for heat transfer enhancement, in particular in cooling of electronic devices with high heat density. This paper presents an experimental study of heat transfer by an impinging circular water jet. A Constantan foil with the size of 5 mm × 5 mm was used to simulate a microelectronic chip with heat generated by passing an electrical current through the foil. A high heat flux over 106 W/m2 was achieved. The surface temperature was measured by a thermocouple glued onto the back surface of the foil. Both a free surface jet and a submerged jet were investigated. Effect of the nozzle-to-surface spacing as well as the jet speed at the exit of the nozzle on cooling was examined. By positioning the jet away from the center of the heating foil surface, the radial variation of the heat transfer coefficients over the foil was also investigated. Quantitative heat transfer data have been obtained and analyzed.

This content is only available via PDF.
You do not currently have access to this content.