Multiphase Cooling of High Frequency Conductors Encased in a Porous Medium Available to Purchase

This study presents a new method for cooling high frequency conductors requiring substantial structural support. This new method of cooling involves boiling a dielectric, fluorinert™ refrigerant that is in direct contact with the supported conductor. A porous, dielectric medium was created for structural support with enough interconnected voids to sustain liquid-vapor flow. A pool boiling test chamber was constructed to investigate the heat transfer characteristics of a conductor encased in a porous medium. The conductor-porous media assembly was mounted horizontally on two conductor posts and submerged into the liquid. The tests were performed using support structures with different interconnected void sizes. A DC power supply was used to apply heat to the conductor and all tests were performed at the saturation temperature. Critical heat flux was captured and each assembly evaluated for best performance in transferring heat. The results from these experiments will enhance the cooling technology used in high frequency conductor applications.