Loop Heat Pipes (LHPs) have gained acceptance among spacecraft engineers in recent years as high performance heat transport devices for thermal control systems (TCS). However, the most common criticism from people who use LHPs is that their behavior is difficult to predict. Complex interaction of thermodynamics and fluid flow dynamics inside a LHP poses a challenge for the analytical modeling of its performance. The need for a complete understanding of mechanisms involving the heat and mass transfer in a LHP cannot be overstated. During the initial spacecraft TCS design phase, trade studies are usually carried out to select an appropriate thermal control concept for the design. The inability to accurately predict the LHP response in the actual operating environment often leads to the dismissal of LHPs for lack of certainty. This paper attempts to present a simplistic explanation of LHP operation in terms of heat and mass transfer processes, in hope that it will help the potential end-users to understand the technology better. Most of the observed phenomena described herein are based on available test data of various LHP systems. Nevertheless, a few anomalies especially during operational transients are still not well understood. For that, research ideas will also be proposed.
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ASME 2003 Heat Transfer Summer Conference
July 21–23, 2003
Las Vegas, Nevada, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-3694-0
PROCEEDINGS PAPER
Heat and Mass Transfer in Loop Heat Pipes
Triem T. Hoang,
Triem T. Hoang
TTH Research, Inc., Capitol Heights, MD
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Jentung Ku
Jentung Ku
NASA Goddard Space Flight Center, Greenbelt, MD
Search for other works by this author on:
Triem T. Hoang
TTH Research, Inc., Capitol Heights, MD
Jentung Ku
NASA Goddard Space Flight Center, Greenbelt, MD
Paper No:
HT2003-47366, pp. 485-493; 9 pages
Published Online:
December 17, 2008
Citation
Hoang, TT, & Ku, J. "Heat and Mass Transfer in Loop Heat Pipes." Proceedings of the ASME 2003 Heat Transfer Summer Conference. Heat Transfer: Volume 2. Las Vegas, Nevada, USA. July 21–23, 2003. pp. 485-493. ASME. https://doi.org/10.1115/HT2003-47366
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