This paper reports some of the results of our tests for the development of a high heat flux cooling system for thermal management of high power electronics. Our objective is to develop a practical design solution for achieving 1000 W/cm2 cooling. To achieve such high heat transfer rates, we have pursued and combined design advantages of a microchannel heat exchanger, high heat fluxes associated with forced convective nucleate boiling, and the use of a nanoparticles laden fluid for enhancement of heat transfer. A laboratory test module was designed, built, and tested to verify its performance. The experimental system employed sub-cooled as well as saturated forced convection boiling heat transfer in a high aspect ratio parallel microchannel heat sink. The working fluids tested were water and a selection of ceramic-based nanoparticle suspensions (nanofluids). The system was observed to readily dissipate heat fluxes in excess of 275 W/cm2 of substrate, while maintaining the substrate at or below 125°C. For optimized fin geometry, the current conditions would result in greater than 500 W/cm2. While the use of nanofluids was intended for boiling enhancement to push the envelop beyond 1000 W/cm2, we discerned limited improvement in the overall heat transfer rate. Future studies are planned for further exploitation of nanoparticles for enhancement of convective nucleate boiling.
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ASME 2003 Heat Transfer Summer Conference
July 21–23, 2003
Las Vegas, Nevada, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-3694-0
PROCEEDINGS PAPER
Forced Convective Boiling in Microchannels for kW/cm2 Electronics Cooling Available to Purchase
Daniel J. Faulkner,
Daniel J. Faulkner
MicroEnergy Technologies, Inc., Vancouver, WA
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Reza Shekarriz
Reza Shekarriz
MicroEnergy Technologies, Inc., Vancouver, WA
Search for other works by this author on:
Daniel J. Faulkner
MicroEnergy Technologies, Inc., Vancouver, WA
Reza Shekarriz
MicroEnergy Technologies, Inc., Vancouver, WA
Paper No:
HT2003-47160, pp. 329-336; 8 pages
Published Online:
December 17, 2008
Citation
Faulkner, DJ, & Shekarriz, R. "Forced Convective Boiling in Microchannels for kW/cm2 Electronics Cooling." Proceedings of the ASME 2003 Heat Transfer Summer Conference. Heat Transfer: Volume 2. Las Vegas, Nevada, USA. July 21–23, 2003. pp. 329-336. ASME. https://doi.org/10.1115/HT2003-47160
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