This study further develops the standard laser flash method for the measurement of multiple thermal properties of semiconductor melts. The standard laser flash method is widely used to measure thermal diffusivity of solids. Our modified procedure allows thermal diffusivity, thermal conductivity, and specific heat capacity of molten semiconductor material to be determined simultaneously. The transient heat transfer process in the melt and its quartz container was computationally studied in detail. A fitting procedure based on the numerical result and the least root-mean-square error fitting to the experimental data was used to extract thermal diffusivity, specific heat capacity, and thermal conductivity. The results for tellurium (Te) at 873 K: specific heat capacity 300.2 J/kg K, thermal conductivity 3.50 W/m K, thermal diffusivity 2.04×10−6 m2/s, are in good agreement with data published in the literature. Furthermore, uncertainty analysis showed quantitatively the effect of sample geometry, transient temperature measured, and the energy of the laser pulse on the results.
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ASME 2003 Heat Transfer Summer Conference
July 21–23, 2003
Las Vegas, Nevada, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-3693-2
PROCEEDINGS PAPER
Thermal Property Measurement of Semiconductor Melt Using Modified Laser Flash Method
Bochuan Lin,
Bochuan Lin
University of Alabama at Birmingham, Birmingham, AL
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Shen Zhu,
Shen Zhu
NASA Marshall Space Flight Center, Huntsville, AL
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Heng Ban,
Heng Ban
University of Alabama at Birmingham, Birmingham, AL
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Chao Li,
Chao Li
University of Alabama at Birmingham, Birmingham, AL
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Rosalia N. Scripa,
Rosalia N. Scripa
University of Alabama at Birmingham, Birmingham, AL
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Ching-Hua Su,
Ching-Hua Su
NASA Marshall Space Flight Center, Huntsville, AL
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Sandor L. Lehoczky
Sandor L. Lehoczky
NASA Marshall Space Flight Center, Huntsville, AL
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Bochuan Lin
University of Alabama at Birmingham, Birmingham, AL
Shen Zhu
NASA Marshall Space Flight Center, Huntsville, AL
Heng Ban
University of Alabama at Birmingham, Birmingham, AL
Chao Li
University of Alabama at Birmingham, Birmingham, AL
Rosalia N. Scripa
University of Alabama at Birmingham, Birmingham, AL
Ching-Hua Su
NASA Marshall Space Flight Center, Huntsville, AL
Sandor L. Lehoczky
NASA Marshall Space Flight Center, Huntsville, AL
Paper No:
HT2003-47448, pp. 833-839; 7 pages
Published Online:
December 17, 2008
Citation
Lin, B, Zhu, S, Ban, H, Li, C, Scripa, RN, Su, C, & Lehoczky, SL. "Thermal Property Measurement of Semiconductor Melt Using Modified Laser Flash Method." Proceedings of the ASME 2003 Heat Transfer Summer Conference. Heat Transfer: Volume 1. Las Vegas, Nevada, USA. July 21–23, 2003. pp. 833-839. ASME. https://doi.org/10.1115/HT2003-47448
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