A source item-based computation model is developed for analysing phase-change heat transfer within Microencapsulated PCM suspending in a flowing carrier fluid to enhance convective heat transfer, with the consideration of phase-change temperature range and varying thermal properties. Solution is obtained by developing a control volume-based finite difference code, in which TDMA method combined with under-relaxation is used to solve a strong nonlinear equation. The code developed for this study can be used for evaluating Microencapsulated PCM suspension and instructing the preparation of Microencapsulated PCM.
Numerical Simulation on Phase-Change Heat Transfer Within Microencapsulated Phase Change Material
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Rao, Y, & Lin, G. "Numerical Simulation on Phase-Change Heat Transfer Within Microencapsulated Phase Change Material." Proceedings of the ASME 2003 Heat Transfer Summer Conference. Heat Transfer: Volume 1. Las Vegas, Nevada, USA. July 21–23, 2003. pp. 187-193. ASME. https://doi.org/10.1115/HT2003-47023
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