Micro fluidics devices are conventionally used for boundary layer control in many aerospace applications. Synthetic Jets are intense small scale turbulent jets formed from entrainment and expulsion of the fluid in which they are embedded. The idea of using synthetic jets in confined electronic cooling applications started in late 1990s. These micro fluidic devices offer very efficient, high magnitude direct air-cooling on the heated surface. A proprietary synthetic jet designed in General Electric Company was able to provide a maximum air velocity of 90 m/s from a 1.2 mm hydraulic diameter rectangular orifice. An experimental study for determining the thermal performance of a meso scale synthetic jet was carried out. The synthetic jets are driven by a time harmonic signal. During the experiments, the operating frequency for jets was set between 3 and 4.5 kHz. The resonance frequency for a particular jet was determined through the effect on the exit velocity magnitude. An infrared thermal imaging technique was used to acquire fine scale temperature measurements. A square heater with a surface area of 156 mm2 was used to mimic the hot component and extensive temperature maps were obtained. The parameters varied during the experiments were jet location, driving jet voltage, driving jet frequency and heater power. The output parameters were point wise temperatures (pixel size = 30 μm), and heat transfer enhancement over natural convection. A maximum of approximately 8 times enhancement over natural convection heat transfer was measured. The maximum coefficient of cooling performance obtained was approximately 6.6 due to the low power consumption of the synthetic jets.
Skip Nav Destination
ASME 2004 Heat Transfer/Fluids Engineering Summer Conference
July 11–15, 2004
Charlotte, North Carolina, USA
Conference Sponsors:
- Heat Transfer Division and Fluids Engineering Division
ISBN:
0-7918-4693-8
PROCEEDINGS PAPER
Micro Fluidic Jets for Thermal Management of Electronics
Jivtesh Garg,
Jivtesh Garg
GE Global Research Center, Niskayuna, NY
Search for other works by this author on:
Mehmet Arik,
Mehmet Arik
GE Global Research Center, Niskayuna, NY
Search for other works by this author on:
Stanton Weaver,
Stanton Weaver
GE Global Research Center, Niskayuna, NY
Search for other works by this author on:
Seyed Saddoughi
Seyed Saddoughi
GE Global Research Center, Niskayuna, NY
Search for other works by this author on:
Jivtesh Garg
GE Global Research Center, Niskayuna, NY
Mehmet Arik
GE Global Research Center, Niskayuna, NY
Stanton Weaver
GE Global Research Center, Niskayuna, NY
Seyed Saddoughi
GE Global Research Center, Niskayuna, NY
Paper No:
HT-FED2004-56782, pp. 647-654; 8 pages
Published Online:
February 24, 2009
Citation
Garg, J, Arik, M, Weaver, S, & Saddoughi, S. "Micro Fluidic Jets for Thermal Management of Electronics." Proceedings of the ASME 2004 Heat Transfer/Fluids Engineering Summer Conference. Volume 4. Charlotte, North Carolina, USA. July 11–15, 2004. pp. 647-654. ASME. https://doi.org/10.1115/HT-FED2004-56782
Download citation file:
35
Views
Related Proceedings Papers
Related Articles
Meso Scale Pulsating Jets for Electronics Cooling
J. Electron. Packag (December,2005)
A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages
J. Heat Transfer (November,1998)
Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics
J. Heat Transfer (January,2005)
Related Chapters
Extended Surfaces
Thermal Management of Microelectronic Equipment
Extended Surfaces
Thermal Management of Microelectronic Equipment, Second Edition
Cavitating Structures at Inception in Turbulent Shear Flow
Proceedings of the 10th International Symposium on Cavitation (CAV2018)