The paper presents an experimental and numerical study of the effect of spray angle on spray cooling when applied in the thermal management of electronics. A thermal test chip provided the heated target, and was cooled by a single pressure swirl atomizer. A perfluorocarbon (PF5060) was employed as the coolant. The coolant was subcooled to a fixed level of 26° C, and was sprayed directly onto the heated target at a fixed flow rate of 22 ml/min. The spray angle was varied between 0 and 60 degrees, and the outlet of the atomizer was located at a fixed radius of 1.4 cm from the heated target. The model of Mudawar and Estes (1996) was also modified to account for the effect of spray angle, then used to assist in interpretation of the experimental data. In an effort to estimate the heat transfer characteristics, an inverse heat transfer algorithm is developed. A direct finite element model is applied with estimated heat flux distributions to simulate the thermal field in the test microchip for various cooling conditions. Experimental results are presented for a number of cases and compared with the model’s predictions. The experimental data and model both showed that cooling capability dropped off when spray angle exceeded 50 degrees.
Skip Nav Destination
ASME 2004 Heat Transfer/Fluids Engineering Summer Conference
July 11–15, 2004
Charlotte, North Carolina, USA
Conference Sponsors:
- Heat Transfer Division and Fluids Engineering Division
ISBN:
0-7918-4693-8
PROCEEDINGS PAPER
Effect of Spray Angle in Spray Cooling Thermal Management of Electronics
J. Schwarzkopf,
J. Schwarzkopf
Isothermal Systems Research, Liberty Lake, WA
Search for other works by this author on:
T. Cader,
T. Cader
Isothermal Systems Research, Liberty Lake, WA
Search for other works by this author on:
K. Okamoto,
K. Okamoto
Washington State University, Pullman, WA
Search for other works by this author on:
B. Q. Li,
B. Q. Li
Washington State University, Pullman, WA
Search for other works by this author on:
B. Ramaprian
B. Ramaprian
Washington State University, Pullman, WA
Search for other works by this author on:
J. Schwarzkopf
Isothermal Systems Research, Liberty Lake, WA
T. Cader
Isothermal Systems Research, Liberty Lake, WA
K. Okamoto
Washington State University, Pullman, WA
B. Q. Li
Washington State University, Pullman, WA
B. Ramaprian
Washington State University, Pullman, WA
Paper No:
HT-FED2004-56414, pp. 423-431; 9 pages
Published Online:
February 24, 2009
Citation
Schwarzkopf, J, Cader, T, Okamoto, K, Li, BQ, & Ramaprian, B. "Effect of Spray Angle in Spray Cooling Thermal Management of Electronics." Proceedings of the ASME 2004 Heat Transfer/Fluids Engineering Summer Conference. Volume 4. Charlotte, North Carolina, USA. July 11–15, 2004. pp. 423-431. ASME. https://doi.org/10.1115/HT-FED2004-56414
Download citation file:
34
Views
Related Proceedings Papers
Related Articles
Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics
J. Heat Transfer (January,2005)
High-Flux Thermal Management With Supercritical Fluids
J. Heat Transfer (December,2016)
Related Chapters
Thermoelectric Coolers
Thermal Management of Microelectronic Equipment
Herbie's Homework Helpers
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
Numerical Simulation of Nucleate Spray Cooling: Effect of Droplet Impact on Bubble Growth and Heat Transfer in a Thin Liquid Film
Inaugural US-EU-China Thermophysics Conference-Renewable Energy 2009 (UECTC 2009 Proceedings)