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Proceedings Papers
ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4734-9
In This Volume
Heat Transfer: Volume 4
Heat Transfer in Energy Systems
Heat Transfer in Fuel Cells
Heat Transfer in Hydrogen Generation and Storage Systems
High Temperature Heat Exchangers
The Flow Calculations in the High Temperature Heat Exchanger With the Manufacturing Geometrical Effects
Valery Ponyavin, Sundaresan Subramanian, Clayton Ray De Losier, Yitung Chen, Anthony E. Hechanova, Per F. Peterson
Topics:
Flow (Dynamics)
,
Heat exchangers
,
Heat transfer
,
High temperature
,
Manufacturing
,
Turbulence
Precision Thermal Control
Radiation in Energy Systems
Thermal/Structural Integrated Modeling
Heat Transfer Equipment
Heat Transfer Equipment and Heat Exchangers
Variable Test Furnace Cooling
Topics:
Cooling
,
Furnaces
,
Heat exchangers
An Investigation Into the Effects of Steam Condensation on Fluid Distribution When Occurring on the Tube Side of a Miniature Shell and Tube Heat Exchanger
Topics:
Condensation
,
Fluids
,
Heat exchangers
,
Shells
,
Steam
,
Condensed matter
,
Flow (Dynamics)
,
Surface tension
,
Tubing
,
Wall thickness
Use of Computational Fluid Dynamics in the Design and Optimization of Microchannel Heat Exchangers for Microelectronics Cooling
Topics:
Computational fluid dynamics
,
Cooling
,
Design
,
Heat exchangers
,
Microchannels
,
Microelectronic devices
,
Optimization
,
Circuits
,
Convection
,
Cooling systems
Heat Transfer in Electronic Equipment
Advanced Technologies in Electronics Cooling
Convection in Electronics Cooling
Experimental Investigation of the Heat Transfer Performance of Arrays of Round Jets With Sharp-Edged Orifices and Peripheral Effluent: Convective Behavior of Water on a Heated Silicon Surface
Topics:
Heat transfer
,
Jets
,
Orifices
,
Silicon
,
Water
,
Flow (Dynamics)
,
Construction
,
Exhaust systems
,
Fluids
,
Heat conduction
Fundamentals of Electronic Cooling
Heat Transfer in Electronic Equipment
Micro- and Nano-Scale Transport in Electronics
Thermal Characterization for Electronics Cooling
Novel Process Techniques to Reduce Voids in Solder Thermal Interface Materials Used for Flip-Chip Package Applications
M. Montano, J. Garcia, W. Shi, M. T. Reiter, U. Vadakkan, K. L. Phillippe, B. Clark, M. Valles, C. Deppisch, J. D. Ferrara-Brown, S. G. Jadhav, E. Bernal, M. K. Kuan
Topics:
Electronic packages
,
Flip-chip
,
Flip-chip packages
,
Solders
Symposium in Honor of Bora Mikic
Industrial Applications of Thermal Devices With Meso-Scale Features
Kevin W. Kelly, Andrew McCandless, Christophe Marques, Ryan A. Turner, Patrick Luke, Shariar Motakef, Matthew R. Overholt
Topics:
Cooling
,
Cross-flow
,
Design
,
Flow (Dynamics)
,
Heat exchangers
,
Heat transfer
,
Heat transfer coefficients
,
Jets
,
Manufacturing
,
Microchannels