A Numerical Investigation on Fluid-Thermal-Structure Coupling Characteristics of Laminated Film Cooling Configurations

This paper presents a numerical approach to study the fluid-thermal-structure coupling problems of laminated film cooling configurations. The SST k-ω turbulence model, T-grid technology, and SIMPLEC algorithm in the commercial tool Fluent 6.3 were employed to solve the coupling problems of flowing fluid and heat transfer within the solid configurations. The numerical method and program were validated with the experimental date obtained by an infrared thermal imaging system in the first part of this work. The validated method and program were applied to analyze the coupling effects of variant solid structure devices, and the influences of film-hole angles and rib-arrangements on cooling effectiveness were compared. The temperature fields obtained by the validated program were input into another commercial tool, Ansys 11, to estimate the thermal stress profiles within the configurations. The fluid-thermal-structure characteristics of the laminated cooling configurations were synthetically discussed.