A novel resist stripping and surface cleaning technique is proposed. We have improved wet vapor resist stripping technique (Ojima & Ohmi) using high-speed steam and purified water droplets mixture. Relatively low pressure steam (0.1MPa∼0.2MPa) is mixed with purified water in front of the nozzle, and sprayed to Si wafer with resist. Using this new technique, we are able to strip resist without chemicals very quickly and also to clean a wafer surface, i.e., to eliminate some particles. This technique has an advantage not only in reducing some processes of semiconductor manufacturing but also in maintaining chemical-free environment. Both droplet velocity and diameter distributions were measured by Phase Doppler Anemometer (PDA). Resist stripping was observed with a high-speed video camera and the fringes of the removed resist region were observed with a digital microscope. Mechanism of this resist stripping process is discussed.
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ASME/JSME 2007 5th Joint Fluids Engineering Conference
July 30–August 2, 2007
San Diego, California, USA
Conference Sponsors:
- Fluids Engineering Division
ISBN:
0-7918-4288-6
PROCEEDINGS PAPER
Resist Stripping and Surface Cleaning Technique Using High Speed Steam-Droplet Mixture
T. Sanada,
T. Sanada
Shizuoka University, Hamamatsu, Shizuoka, Japan
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M. Watanabe,
M. Watanabe
Kyushu University, Fukuoka, Japan
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Y. Morita,
Y. Morita
Aqua Science Corporation, Yokohama, Japan
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M. Yamase
M. Yamase
Aqua Science Corporation, Yokohama, Japan
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T. Sanada
Shizuoka University, Hamamatsu, Shizuoka, Japan
M. Shirota
AIST, Fukuoka, Japan
M. Watanabe
Kyushu University, Fukuoka, Japan
Y. Morita
Aqua Science Corporation, Yokohama, Japan
M. Yamase
Aqua Science Corporation, Yokohama, Japan
Paper No:
FEDSM2007-37129, pp. 499-506; 8 pages
Published Online:
March 30, 2009
Citation
Sanada, T, Shirota, M, Watanabe, M, Morita, Y, & Yamase, M. "Resist Stripping and Surface Cleaning Technique Using High Speed Steam-Droplet Mixture." Proceedings of the ASME/JSME 2007 5th Joint Fluids Engineering Conference. Volume 1: Symposia, Parts A and B. San Diego, California, USA. July 30–August 2, 2007. pp. 499-506. ASME. https://doi.org/10.1115/FEDSM2007-37129
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