In this paper, numerical simulations of a coupling phenomenon including flow of thermal fluid and heat transfer in a solid are performed on a PC-cluster. To simulate the coupling phenomenon, the flow and the heat transfer in solid are computed simultaneously by solving the same governing equations in which the flow velocity in the solid region is set to zero. By using this method, good parallel efficiency is obtained on PC-Clusters. Some problems, which are cooling of a large-scale integration (LSI) package, flow around a heated candlestick and the internal and external flows of two tubes with consideration of heat transfer, are solved. It is confirmed that the coupling phenomenon of flow and heat transfer can be treated easily using this approach on a parallel environment.
Parallel Finite Element Analysis of Flow and Heat Transfer on PC-Cluster
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Shirazaki, M, & Himeno, R. "Parallel Finite Element Analysis of Flow and Heat Transfer on PC-Cluster." Proceedings of the ASME/JSME 2003 4th Joint Fluids Summer Engineering Conference. Volume 1: Fora, Parts A, B, C, and D. Honolulu, Hawaii, USA. July 6–10, 2003. pp. 2211-2216. ASME. https://doi.org/10.1115/FEDSM2003-45445
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