Finite element analyses were conducted using commercial software ABAQUS to analyze the mechanical behavior of single-lap adhesive-bonded joints. Adhesive was characterized for the stress-strain relation by comparing the apparent shear-strain relations obtained from finite element analysis and experiments following ASTM D 5656 “Standard Test Method for Thick-Adherend Metal Lap-Shear Joints for Determination of the Stress-Strain Behavior of Adhesives in Shear by Tension Loading.” With the established stress-strain relation, two failure criteria using equivalent plastic strain and J-integral were used to predict the failure load for joint specimens following ASTM D 5656 and ASTM D 3165 (Strength Properties of Adhesives in Shear by Tension Loading of Single-Lap-Joint Laminated Assemblies), respectively. Bondline thicknesses of 0.013”, 0.04”, 0.08”, and 0.12” were used in the investigation. Good correlation was found between the finite element results and the experimental results.
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ASME 2002 Engineering Technology Conference on Energy
February 4–5, 2002
Houston, Texas, USA
Conference Sponsors:
- Petroleum Institute
ISBN:
0-7918-3591-X
PROCEEDINGS PAPER
Finite Element Analysis of Adhesive-Bonded Single-Lap Joints
Charles Yang,
Charles Yang
Wichita State University, Wichita, KS
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Zhidong Guan,
Zhidong Guan
Wichita State University, Wichita, KS
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John S. Tomblin,
John S. Tomblin
Wichita State University, Wichita, KS
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Wenjun Sun
Wenjun Sun
Wichita State University, Wichita, KS
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Charles Yang
Wichita State University, Wichita, KS
Zhidong Guan
Wichita State University, Wichita, KS
John S. Tomblin
Wichita State University, Wichita, KS
Wenjun Sun
Wichita State University, Wichita, KS
Paper No:
ETCE2002/CMDA-29074, pp. 185-190; 6 pages
Published Online:
January 7, 2009
Citation
Yang, C, Guan, Z, Tomblin, JS, & Sun, W. "Finite Element Analysis of Adhesive-Bonded Single-Lap Joints." Proceedings of the ASME 2002 Engineering Technology Conference on Energy. Engineering Technology Conference on Energy, Parts A and B. Houston, Texas, USA. February 4–5, 2002. pp. 185-190. ASME. https://doi.org/10.1115/ETCE2002/CMDA-29074
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