Sintered diamonds are used in grinding because they offer better mechanical properties than conventional materials (mineral or silicon carbide abrasives) and yield high grinding speed and long life. In addition, because of their thermal performance, they contribute to cooling the workpiece, avoiding excessive temperatures. Thus in order to choose the best material for the worktool, one often must know the thermal conductivity of sintered diamond. In this work, the thermal conductivity of sintered diamond is evaluated as a function of the volume fraction of diamond in the composite and for two types of metallic binders: hard and soft. The measurement technique is based on the flash method that associates heating and measurement devices without sample contact and on parameter estimation using a three-layer thermal model. With a hard metallic binder, the thermal conductivity of sintered diamond was found to increase up to 64% for diamond volume fraction increasing from 0 to 25%. The increase is much smaller for the soft binder: 35% for diamond volume reaching 25%. In addition, experimental data were found far below the value predicted by conventional analytical models for effective thermal conductivity. A possible explanation is that the thermal conductivity of such composites is affected by poor heat transfer at the diamond/binder interface, the thermal contact resistance between matrix and diamond particles being estimated at between 0.75 and 1.25 10−6 m2K.W−1.
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ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis
July 2–4, 2012
Nantes, France
Conference Sponsors:
- International
ISBN:
978-0-7918-4485-4
PROCEEDINGS PAPER
Thermal Properties of Sintered Diamond Composites Used in Grinding Available to Purchase
Tala Moussa,
Tala Moussa
Nantes University, Nantes, France
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Bertrand Garnier,
Bertrand Garnier
Nantes University, Nantes, France
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Hassan Peerhossaini
Hassan Peerhossaini
Nantes University, Nantes, France
Search for other works by this author on:
Tala Moussa
Nantes University, Nantes, France
Bertrand Garnier
Nantes University, Nantes, France
Hassan Peerhossaini
Nantes University, Nantes, France
Paper No:
ESDA2012-82479, pp. 669-675; 7 pages
Published Online:
August 12, 2013
Citation
Moussa, T, Garnier, B, & Peerhossaini, H. "Thermal Properties of Sintered Diamond Composites Used in Grinding." Proceedings of the ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis. Volume 2: Applied Fluid Mechanics; Electromechanical Systems and Mechatronics; Advanced Energy Systems; Thermal Engineering; Human Factors and Cognitive Engineering. Nantes, France. July 2–4, 2012. pp. 669-675. ASME. https://doi.org/10.1115/ESDA2012-82479
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