A novel 6-Degree-of-Freedom (DoF) hybrid haptic device is presented in this paper. Hybrid mechanism consists of parallel kinematic structure, R-CUBE and a 3-DoF orientation mechanism. In our previous study, the original configuration of the R-CUBE mechanism was investigated. In this work, the original design of R-CUBE is reconfigured as a haptic mechanism and the final mechanism is reoriented in order to equally distribute the gravitational effects to all grounded actuators. Rotational motions of the end-effector are monitored through the 3-DoF orientation mechanism placed on the moving platform of the parallel platform. The design of this haptic device is suitable to reflect forces in translational motions, thus point-type of contact is available for this system. The designed device is manufactured utilizing various types of manufacturing processes, such as wire erosion, laser cutting, milling and turning. Finally manufactured mechanism is integrated with electromechanical components and tested for manipulability.
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ASME 2010 10th Biennial Conference on Engineering Systems Design and Analysis
July 12–14, 2010
Istanbul, Turkey
Conference Sponsors:
- International
ISBN:
978-0-7918-4917-0
PROCEEDINGS PAPER
Development of an R-Cube-Based General Purpose Haptic Device System Available to Purchase
Tunc¸ Bilgincan,
Tunc¸ Bilgincan
I˙zmir Institute of Technology, Urla, I˙zmir, Turkey
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Mehmet I˙smet Can Dede
Mehmet I˙smet Can Dede
I˙zmir Institute of Technology, Urla, I˙zmir, Turkey
Search for other works by this author on:
Tunc¸ Bilgincan
I˙zmir Institute of Technology, Urla, I˙zmir, Turkey
Mehmet I˙smet Can Dede
I˙zmir Institute of Technology, Urla, I˙zmir, Turkey
Paper No:
ESDA2010-24596, pp. 675-682; 8 pages
Published Online:
December 28, 2010
Citation
Bilgincan, T, & Dede, MIC. "Development of an R-Cube-Based General Purpose Haptic Device System." Proceedings of the ASME 2010 10th Biennial Conference on Engineering Systems Design and Analysis. ASME 2010 10th Biennial Conference on Engineering Systems Design and Analysis, Volume 3. Istanbul, Turkey. July 12–14, 2010. pp. 675-682. ASME. https://doi.org/10.1115/ESDA2010-24596
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