In the last few years high-tendency electronic devices have improved to a larger processing capability with smaller physical dimensions. This fact coupled to traditional cooling mechanisms, are not able to dissipate the high heat fluxes generated by these devices (around 200 W/cm2.) Microchannel heat sinks are the new tendency in heat dissipation. Many of the studies done before had used single-phase water as cooling fluid in laminar flow. Operating within this regimen, and using water as the cooling fluid, the dissipated heat flux is not enough to keep optimal operational conditions in the electronic devices. Therefore, this work presents a thermal and hydraulic numerical analysis for a microchannel heat sink with circular cross section, fabricated in a silicon substrate. The channel cross section is variable, being a function of the heat sink longitudinal position, decreasing as the cooling fluid passes through the channel. The ratio between the inlet and outlet diameters is given as a function of the Biomimic tendency. These theories are based on the behavior that nature has for the mass transport in circular ducts. The cooling fluid used in this study is water in single-phase. These microchannels heat sink arrangements are based in the operational and geometrical parameters of previous works developed by several authors on microchannels heat sinks with constant and conventional cross sections.

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