In this work we present modeling, fabrication and characterization of novel electromagnetic microactuators with integrated resin-bonded hard magnets embedded in the handle of silicon-on-insulator (SOI) wafers. Trenches etched through the handle of the SOI wafers are filled with the resin-bonded magnet material and allowed to cure at ambient temperature. Clamped-clamped beams fabricated from the single crystal silicon device layer of the SOI wafer are fabricated above the resin-bonded magnet filled trenches. Applying alternating current through the beam produces steady out-of-plane displacements due to resistive Joule heating and excites in-plane resonant vibrations due to Lorentz force coupling. The 8 mm long, 32 μm wide beams produced a maximum in-plane amplitude of 4.2 μm under an applied 2.4 mA current while the resonant frequency was tuned by changing the current amplitude. The results provided by the coupled thermo-electro-mechanical model of the beam and backed by experiments suggest that the integrated resin bonded magnets can be efficiently used for the actuation of micro structures.

This content is only available via PDF.
You do not currently have access to this content.