Copper Matrix Composites reinforced with particulate Silicon Carbide were consolidated by Vacuum Hot Pressing and Press-Sinter routes. The reinforcement content was varied from 10% to 30% by volume. The composites were then characterized for their microstructure, density, X-ray diffraction (XRD), Coefficient of Thermal Expansion (CTE), hardness, tensile strength, electrical conductivity and elastic modulus. The properties were compared with those of Copper Tungsten alloys. Cu/SiC composites are found to be potential materials for electrical contact and welding applications. An attempt has also been made to evaluate the suitability of copper matrix composites as a replacement to copper tungsten alloys.

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