The phonon Boltzmann transport equation model is used to evaluate the reduction of out-of-plane thermal conductivity and subsequent increase in thermoelectric figure of merit when an angular interface is patterned between a germanium thin-film and silicon substrate. According to the acoustic mismatch model, the angular structure reduces the out-of-plane thermal conductivity by spatially redistributing phonons traveling in the out-of-plane direction. Simulation results demonstrate a 43% reduction in out-of-plane thermal conductivity when operating in the fully ballistic regime. This decrease in phononic thermal conductivity would result in an increase of intrinsic thermoelectric efficiency by a factor of 1.75.
- Advanced Energy Systems Division and Solar Energy Division
Increasing Efficiencies of Thermoelectric Devices Through Angular Interface Geometries
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Sellan, DP, & Amon, CH. "Increasing Efficiencies of Thermoelectric Devices Through Angular Interface Geometries." Proceedings of the ASME 2009 3rd International Conference on Energy Sustainability collocated with the Heat Transfer and InterPACK09 Conferences. ASME 2009 3rd International Conference on Energy Sustainability, Volume 1. San Francisco, California, USA. July 19–23, 2009. pp. 781-789. ASME. https://doi.org/10.1115/ES2009-90058
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