This paper presents the development of a piezo-based three-degree-of-freedom (3-DOF), tripedal microrobotic platform that allows for unlimited travel with sub-micron precision over a planar surface. Compliant mechanical amplifiers are incorporated with each piezoelectric stack actuator to improve both the stroke and load-bearing capability of the platform. A forward kinematic model of the stage based on its tripedal leg architecture is derived for each stick-slip step cycle and inverted for feedforward control of the platform. A prototype is constructed using low-cost 3D-printing techniques. Experimental results demonstrate actuator stroke of 29.4 μm on average with a dominant resonance of approximately 860 Hz. Results demonstrate the stage tracks a 3 mm by 3 mm square trajectory in open loop. Feedback control through visual servoing is then simulated on a model that includes flexure dynamics, observed surface interactions, and camera sampling times, reducing the root-mean-square (RMS) tracking error by 90%. This control scheme is then implemented experimentally, resulting in 99% RMS position error reduction relative to when only feedforward control is used.
- Dynamic Systems and Control Division
Development of a 3-DOF Tripedal Stick-Slip Microrobotic Mobile Platform for Unconstrained, Omnidirectional Sample Positioning
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Adibnazari, I, Nagel, WS, & Leang, KK. "Development of a 3-DOF Tripedal Stick-Slip Microrobotic Mobile Platform for Unconstrained, Omnidirectional Sample Positioning." Proceedings of the ASME 2018 Dynamic Systems and Control Conference. Volume 2: Control and Optimization of Connected and Automated Ground Vehicles; Dynamic Systems and Control Education; Dynamics and Control of Renewable Energy Systems; Energy Harvesting; Energy Systems; Estimation and Identification; Intelligent Transportation and Vehicles; Manufacturing; Mechatronics; Modeling and Control of IC Engines and Aftertreatment Systems; Modeling and Control of IC Engines and Powertrain Systems; Modeling and Management of Power Systems. Atlanta, Georgia, USA. September 30–October 3, 2018. V002T24A011. ASME. https://doi.org/10.1115/DSCC2018-9229
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