Currently, the semiconductor manufacturing industries over the world are upgrading from processing 300mm wafers to processing 450mm wafers. In order to satisfy the requirements of producing and processing 450mm wafers, vibration control of wafer handling tools has to make new breakthroughs. This paper introduces an active wide-band vibration rejection method with a vibrotactile actuator and applies it to a wafer transfer robot. Compared to conventional methods based on motor control of the robot, active vibration cancellation with a separate actuator does not risk compromising the tracking accuracy of wafer transfer motions. A three-step controller synthesis scheme is developed by analyzing and combining the strengths of several control strategies. Experimental validation shows a vibration reduction of more than 40% in energy and 30% in amplitude.

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