Currently, the semiconductor manufacturing industries over the world are upgrading from processing 300mm wafers to processing 450mm wafers. In order to satisfy the requirements of producing and processing 450mm wafers, vibration control of wafer handling tools has to make new breakthroughs. This paper introduces an active wide-band vibration rejection method with a vibrotactile actuator and applies it to a wafer transfer robot. Compared to conventional methods based on motor control of the robot, active vibration cancellation with a separate actuator does not risk compromising the tracking accuracy of wafer transfer motions. A three-step controller synthesis scheme is developed by analyzing and combining the strengths of several control strategies. Experimental validation shows a vibration reduction of more than 40% in energy and 30% in amplitude.
- Dynamic Systems and Control Division
Active Wide-Band Vibration Rejection for Semiconductor Manufacturing Robots
Wang, Z, Wang, C, & Tomizuka, M. "Active Wide-Band Vibration Rejection for Semiconductor Manufacturing Robots." Proceedings of the ASME 2015 Dynamic Systems and Control Conference. Volume 3: Multiagent Network Systems; Natural Gas and Heat Exchangers; Path Planning and Motion Control; Powertrain Systems; Rehab Robotics; Robot Manipulators; Rollover Prevention (AVS); Sensors and Actuators; Time Delay Systems; Tracking Control Systems; Uncertain Systems and Robustness; Unmanned, Ground and Surface Robotics; Vehicle Dynamics Control; Vibration and Control of Smart Structures/Mech Systems; Vibration Issues in Mechanical Systems. Columbus, Ohio, USA. October 28–30, 2015. V003T52A003. ASME. https://doi.org/10.1115/DSCC2015-9776
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