Bending tests on suspended parts of MicroElectroMechanical System (MEMS) can be achieved thanks to nanoindentation techniques. The paper presents the main difficulties met when performing such a test, and shows how they can be reduced by experimental ways. An application is realized on gold bridges, with a validation of some theoretical assumptions.

Volume Subject Area:
Packaging and Reliability Testing
Topics:
Microelectromechanical systems, Nanoindentation, Reliability, Stiffness, Bridges (Structures)
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Copyright © 2006
 by ASME
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