1-9 of 9
Silicon
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Femtosecond Laser Ablation of Implantable Materials

Patrick McEligot, Seth A. Hara, Susheil Uthamaraj
Proc. ASME. DMD2019, 2019 Design of Medical Devices Conference, V001T04A002, April 15–18, 2019
Paper No: DMD2019-3263
DOI: https://doi.org/10.1115/DMD2019-3263
View Paper
PDF
Topics: Laser ablation, Lasers, Machining, Ablation (Vaporization technology), Etching, Manufacturing, Medical devices, Silicon, Ultraviolet radiation, Wavelength
Proceedings Papers

Kinetic Measurement Platform for Open Surgical Skill Assessment

Lasitha Wijayarathne, Frank L. Hammond, III
Proc. ASME. DMD2017, 2017 Design of Medical Devices Conference, V001T08A025, April 10–13, 2017
Paper No: DMD2017-3525
DOI: https://doi.org/10.1115/DMD2017-3525
View Paper
PDF
Topics: Surgery, Kinematics, Biological tissues, Sensors, Surgical tools, Instrumentation, Algorithms, Force control, Force sensors, Image segmentation
Proceedings Papers

Design and Characterization of Shoe Embedded Pressure Sensors for Gait Analysis and Rehabilitation

SeanWolfgang Wachtel, Breanna Hassett, Zhi Qiao, Prudhvi Tej Chinimilli, Wenlong Zhang
Proc. ASME. DMD2017, 2017 Design of Medical Devices Conference, V001T05A005, April 10–13, 2017
Paper No: DMD2017-3424
DOI: https://doi.org/10.1115/DMD2017-3424
View Paper
PDF
Topics: Design, Gait analysis, Pressure sensors, Sensors, Batteries, Calibration, Durability, Engineering prototypes, Errors, Filters
Proceedings Papers

Soft-Robotic Endoscope Tip Design

Mikhail Nuriyev, Rudy Montayre, Austin Taylor, Zion Tsz Ho Tse
Proc. ASME. DMD2017, 2017 Design of Medical Devices Conference, V001T11A024, April 10–13, 2017
Paper No: DMD2017-3528
DOI: https://doi.org/10.1115/DMD2017-3528
View Paper
PDF
Topics: Design, Endoscopes, Robotics, Silicones, Wall thickness, Actuators, Endoscopic devices, Manufacturing, Medical devices, Metals
Proceedings Papers

Magnetically Actuated Micromirror for Endoscopic Applications

Nicholas M. Gunn, Zhian Lai, Mark Bachman
Proc. ASME. BIOMED2010, ASME 2010 5th Frontiers in Biomedical Devices Conference and Exhibition, 61-62, September 20–21, 2010
Paper No: BioMed2010-32045
DOI: https://doi.org/10.1115/BioMed2010-32045
View Paper
PDF
Topics: Endoscopic devices, Microelectromechanical systems, Silicon, Coherence (Optics), Optical instruments, Photodynamic therapy, Polymers
Proceedings Papers

Pulmonary Delivery of Isoproterenol Aerosol Generated With Silicon-Based MHz Ultrasonic Nozzles

S. C. Tsai, R. W. Mao, D. Mukai, S. K. Lin, J. Y. Yang, N. Wang, A. F. Wilson, M. Brenner, S. C. George, P. Wang, C. S. Tsai
Proc. ASME. BIOMED2009, ASME 2009 4th Frontiers in Biomedical Devices, 87-88, June 8–9, 2009
Paper No: BioMed2009-83035
DOI: https://doi.org/10.1115/BioMed2009-83035
View Paper
PDF
Topics: Aerosols, Nozzles, Silicon, Drops, Design, Drug delivery systems, Drugs, Electric propulsion, Ethanol, Microelectromechanical systems
Proceedings Papers

Production of Monodisperse Micron-Size Droplets Using Silicon-Based MHz Ultrasonic Nozzles for Biomedical Applications

Shirley C. Tsai, Yu L. Song, Chih H. Cheng, Ning Wang, Rong W. Mao, Yuan F. Chou, Chin T. Lee, Chen S. Tsai
Proc. ASME. BIOMED2008, ASME 2008 3rd Frontiers in Biomedical Devices Conference, 27-28, June 18–20, 2008
Paper No: BioMed2008-38050
DOI: https://doi.org/10.1115/BioMed2008-38050
View Paper
PDF
Topics: Biomedicine, Drops, Nozzles, Silicon, Design, Particulate matter, Resonance, Water, Waves, Microelectromechanical systems
Proceedings Papers

Design and Simulation of Silicon-Based Ultrasonic Nozzles for Production of Monodispersed Droplets

C. H. Cheng, N. Wang, Y. L. Song, S. C. Tsai, Y. F. Chou, C. T. Lee, C. S. Tsai
Proc. ASME. BIOMED2007, ASME 2007 2nd Frontiers in Biomedical Devices, 11-12, June 7–8, 2007
Paper No: BioMed2007-38023
DOI: https://doi.org/10.1115/BioMed2007-38023
View Paper
PDF
Topics: Design, Drops, Nozzles, Silicon, Simulation, Vibration, Finite element methods, Mode shapes, Resonance, Diseases
Proceedings Papers

Long-Term Reliability of Solder Joints on Wafer-Level Packaged Accelerometer for Medical Applications

Tom Kwa, Thorsten Teutsch
Proc. ASME. BIOMED2007, ASME 2007 2nd Frontiers in Biomedical Devices, 99-102, June 7–8, 2007
Paper No: BioMed2007-38035
DOI: https://doi.org/10.1115/BioMed2007-38035
View Paper
PDF
Topics: Accelerometers, Biomedicine, Reliability, Semiconductor wafers, Solder joints, Manufacturing, Sensors, Solders, Ceilings, Design