Bonding Dissimilar Substrates Using Novel Adhesive and Surface Treatment Methods Free

Three hurdles that exist in selecting materials for the development of new medical devices for neurological treatment are creating a bond between substrates, developing a simple and feasible manufacturing process, and selecting materials that follow regulatory trends to meet possible future requirements. The Elkem team has assessed the adhesion and ideal surface preparation of various grades of thermoplastic polyurethane, metals, and silicone susbstrates with a novel, monocomponent, tin free adhesive that cures in ambient conditions. The surfaces of the substrates were treated via plasma, primer, or a combination of the two. Adhesion was evaluated by determining if the failure mode was adhesive or cohesive. Each of the substrates were successfully bonded using a surface preparation method that yielded cohesive failure. Manufactures now have an option for a fast and relatively simple processing set up that requires less energy than using silicone adhesives currently on the market which opens the door to a wider range of material options.