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Proceedings Papers

Assesment of Vibrational Coupling at Solid-SAM Junctions

Christopher B. Saltonstall, John C. Duda, Patrick E. Hopkins, Pamela M. Norris
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T30051, March 13–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: AJTEC2011-44314
https://doi.org/10.1115/AJTEC2011-44314
View Paper titled, Assesment of Vibrational Coupling at Solid-SAM Junctions
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Topics: Junctions, Chain, Chemical properties, Electrical conductance, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Self-assembly, Thermal conductivity, Thermal properties
Proceedings Papers

A Quantum Mechanical Study of the Thermal Conduction Across a ZrB 2 -SiC Interface as a Function of Temperature and Strain

Vikas Samvedi, Vikas Tomar
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T30063, March 13–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: AJTEC2011-44643
https://doi.org/10.1115/AJTEC2011-44643
View Paper titled, A Quantum Mechanical Study of the Thermal Conduction Across a ZrB 2 -SiC Interface as a Function of Temperature and Strain
Open the PDF for A Quantum Mechanical Study of the Thermal Conduction Across a ZrB 2 -SiC Interface as a Function of Temperature and Strain in another window
Topics: Heat conduction, Temperature, Nanocomposites, Density, Engineering simulation, Grain boundaries, Heat transfer, High temperature, Junctions, Mechanical properties
Proceedings Papers

Flow Pattern Dynamics Around a Vertical Dividing Junction

Mhunir B. Alamu, Barry J. Azzopardi
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10171, March 13–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: AJTEC2011-44582
https://doi.org/10.1115/AJTEC2011-44582
View Paper titled, Flow Pattern Dynamics Around a Vertical Dividing Junction
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Topics: Dynamics (Mechanics), Flow (Dynamics), Junctions, Viscosity, Pipes, Porosity, Bubbly flow, Density, Electrical conductance, Electrical resistance
Proceedings Papers

Numerical Visualization of Heat Flow and Thermal Mixing in Various Differentially Heated Square Cavities Using Bejan’s Heatlines

Ram Satish Kaluri, Tanmay Basak
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10051, March 13–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: AJTEC2011-44420
https://doi.org/10.1115/AJTEC2011-44420
View Paper titled, Numerical Visualization of Heat Flow and Thermal Mixing in Various Differentially Heated Square Cavities Using Bejan’s Heatlines
Open the PDF for Numerical Visualization of Heat Flow and Thermal Mixing in Various Differentially Heated Square Cavities Using Bejan’s Heatlines in another window
Topics: Cavities, Flow (Dynamics), Heat, Heatlines, Visualization, Corners (Structural elements), Temperature, Finite element methods, Fluid dynamics, Galerkin method
Proceedings Papers

Experimental Investigation of Two-Phase Flow in a Multi-Branch Reduced T-Junction With Co-Current Stratified Gas-Liquid Flow

Robert Bowden, Ibrahim Hassan
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10199, March 13–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: AJTEC2011-44606
https://doi.org/10.1115/AJTEC2011-44606
View Paper titled, Experimental Investigation of Two-Phase Flow in a Multi-Branch Reduced T-Junction With Co-Current Stratified Gas-Liquid Flow
Open the PDF for Experimental Investigation of Two-Phase Flow in a Multi-Branch Reduced T-Junction With Co-Current Stratified Gas-Liquid Flow in another window
Topics: Flow (Dynamics), Junctions, Two-phase flow, Flow visualization, Fluids, Pipes, Water
Proceedings Papers

Development and Characterization of an Electroplated Copper Nickel Alloy–Platinum Micro-Thermocouple

S. Loane, P. R. Selvaganapathy, C. Y. Ching
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T30016, March 13–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: AJTEC2011-44302
https://doi.org/10.1115/AJTEC2011-44302
View Paper titled, Development and Characterization of an Electroplated Copper Nickel Alloy–Platinum Micro-Thermocouple
Open the PDF for Development and Characterization of an Electroplated Copper Nickel Alloy–Platinum Micro-Thermocouple in another window
Topics: Copper, Nickel alloys, Platinum, Thermocouples, Electrodeposition, Electrolytic corrosion, Electroplating, Ice, Junctions, Lithography