Self-assembled monolayers (SAMs) have recently garnered much interest due to their unique electrical and chemical properties. The limited literature detailing SAM thermal properties has suggested that thermal boundary conductance (TBC) at solid-SAM junctions is not only low, but also insensitive to changes in SAM length as the number of methylene groups (-CH2-) along alkanedithiol chains is varied from 8 to 10. The present study investigates the vibrational spectra of alkanedithiol SAMs as a function of the number of methylene groups forming the molecule backbone via Hartree-Fock methods and the subsequent effects on TBC calculated using a diffuse scattering model. In particular, the vibrational overlap between the alkanedithiol and Au is studied. It is found that despite the addition of 9 new vibrational modes per added methylene group, only one of those modes is elastically accessible to Au. It is believed that this “vibrational inaccessibility” is the cause of the insensitivity of thermal conductance to molecule length.
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ASME/JSME 2011 8th Thermal Engineering Joint Conference
March 13–17, 2011
Honolulu, Hawaii, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-3892-1
PROCEEDINGS PAPER
Assesment of Vibrational Coupling at Solid-SAM Junctions
Christopher B. Saltonstall,
Christopher B. Saltonstall
University of Virginia, Charlottesville, VA
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John C. Duda,
John C. Duda
University of Virginia, Charlottesville, VA
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Patrick E. Hopkins,
Patrick E. Hopkins
Sandia National Laboratories, Albuquerque, NM
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Pamela M. Norris
Pamela M. Norris
University of Virginia, Charlottesville, VA
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Christopher B. Saltonstall
University of Virginia, Charlottesville, VA
John C. Duda
University of Virginia, Charlottesville, VA
Patrick E. Hopkins
Sandia National Laboratories, Albuquerque, NM
Pamela M. Norris
University of Virginia, Charlottesville, VA
Paper No:
AJTEC2011-44314, T30051; 8 pages
Published Online:
March 1, 2011
Citation
Saltonstall, CB, Duda, JC, Hopkins, PE, & Norris, PM. "Assesment of Vibrational Coupling at Solid-SAM Junctions." Proceedings of the ASME/JSME 2011 8th Thermal Engineering Joint Conference. ASME/JSME 2011 8th Thermal Engineering Joint Conference. Honolulu, Hawaii, USA. March 13–17, 2011. T30051. ASME. https://doi.org/10.1115/AJTEC2011-44314
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