Superlattices made by superposing dielectric and metal nanolayers are of great interest as their small size may increase the thermoelectric figure of merit. Thus it is essential to predict their thermal conductivity. Potentials for Au and Si are discussed and the potential of 2NN MEAM is chosen as being the best for simulating heat transfer in Si/Au systems. Full 2NN MEAM Si/Au cross-potential parametrization is developed and the results are compared with ab initio calculus to test its ability to reproduce local density approximation (LDA) calculations. NVT molecular dynamics simulations are performed to deposit Au atoms on an Si substrate by physical vapor deposition and the results of the intermixing zone are in good agreement with the Cahn and Hilliard theory. Non-equilibrium molecular dynamics simulations are performed for an average temperature of 300 K to determine the Kaptiza conductance of Si/Au systems, and the value of 188 MW/m2K obtained is in good agreement with the results of Komarov et al. for Au deposited on isotopically-pure Si-28 and natural Si, with values ranging between 133 and 182 MW/m2K.
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ASME/JSME 2011 8th Thermal Engineering Joint Conference
March 13–17, 2011
Honolulu, Hawaii, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-3892-1
PROCEEDINGS PAPER
Molecular Dynamics Simulations and Kaptiza Conductance Prediction of Si/Au Systems Using the New Full 2NN MEAM Si/Au Cross-Potential
Carolina Abs da Cruz,
Carolina Abs da Cruz
Universite´ de Lyon, Lyon, France
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Patrice Chantrenne,
Patrice Chantrenne
Universite´ de Lyon, Lyon, France
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Xavier Kleber
Xavier Kleber
Universite´ de Lyon, Lyon, France
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Carolina Abs da Cruz
Universite´ de Lyon, Lyon, France
Patrice Chantrenne
Universite´ de Lyon, Lyon, France
Xavier Kleber
Universite´ de Lyon, Lyon, France
Paper No:
AJTEC2011-44447, T30027; 10 pages
Published Online:
March 1, 2011
Citation
Abs da Cruz, C, Chantrenne, P, & Kleber, X. "Molecular Dynamics Simulations and Kaptiza Conductance Prediction of Si/Au Systems Using the New Full 2NN MEAM Si/Au Cross-Potential." Proceedings of the ASME/JSME 2011 8th Thermal Engineering Joint Conference. ASME/JSME 2011 8th Thermal Engineering Joint Conference. Honolulu, Hawaii, USA. March 13–17, 2011. T30027. ASME. https://doi.org/10.1115/AJTEC2011-44447
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