Nanostructured bismuth telluride based thin films, including nanoparticle and nanocrystalline have been prepared and measured their thermal conductivities. These thin films exhibit an average grain size of from 10 nm to 150 nm. The cross-plane thermal conductivities are measured by 3-omega method at 300 K. The determined nanostructured bismuth telluride thermal conductivities are 0.18 W/(m·K) and nanoparticle bismuth telluride thin film thermal conductivities are from 0.61 W/(m·K) to 0.80 W/(m·K). As compared with bulk alloys at the same atomic composition, both the nanoparticle and nanocrystalline thin films exhibit a reduction in the thermal conductivity. For more detail analysis, the reduction of the thermal conductivity is examined by a simplified phonon gas model on single crystal of bulk bismuth telluride, antimony telluride and bismuth selenide, The analytical model is consistent with the experimental results, and thus we consider that the thermal conductivity is reduced by the strong phonon scattering.
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ASME/JSME 2011 8th Thermal Engineering Joint Conference
March 13–17, 2011
Honolulu, Hawaii, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-3892-1
PROCEEDINGS PAPER
Impact on Thermal Conductivities of Nanostructured Bismuth Telluride Based Thin Films
Saburo Tanaka,
Saburo Tanaka
Kyushu Institute of Technology, Kitakyushu, Fukuoka, Japan
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Masayuki Takashiri,
Masayuki Takashiri
Komatsu Ltd., Hiratsuka, Kanagawa, Japan
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Koji Miyazaki
Koji Miyazaki
Kyushu Institute of Technology, Kitakyushu, Fukuoka, Japan
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Saburo Tanaka
Kyushu Institute of Technology, Kitakyushu, Fukuoka, Japan
Masayuki Takashiri
Komatsu Ltd., Hiratsuka, Kanagawa, Japan
Koji Miyazaki
Kyushu Institute of Technology, Kitakyushu, Fukuoka, Japan
Paper No:
AJTEC2011-44273, T30015; 6 pages
Published Online:
March 1, 2011
Citation
Tanaka, S, Takashiri, M, & Miyazaki, K. "Impact on Thermal Conductivities of Nanostructured Bismuth Telluride Based Thin Films." Proceedings of the ASME/JSME 2011 8th Thermal Engineering Joint Conference. ASME/JSME 2011 8th Thermal Engineering Joint Conference. Honolulu, Hawaii, USA. March 13–17, 2011. T30015. ASME. https://doi.org/10.1115/AJTEC2011-44273
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