The critical heat flux values of copper substrates were increased from 87 to 125 W/cm2 by using a simple chemical process resulting in growth of micro and nano-scale copper structures on the surface. Pre- and post-test surface analysis revealed that the morphology of the micro and nano-scale features of these copper structures changed during the boiling process accompanied by a change in oxide layer composition. Boiling performance of the micro and nano-structured samples was repeatable when testing at lower heat fluxes.
- Heat Transfer Division
Micro-Patterned Substrates With Nano-Scale Elements for Pool Boiling
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Hunter, CN, Glavin, NR, Muratore, C, Fisher, TS, Jones, JG, Putnam, SA, Khramov, AN, & Li, CH. "Micro-Patterned Substrates With Nano-Scale Elements for Pool Boiling." Proceedings of the ASME/JSME 2011 8th Thermal Engineering Joint Conference. ASME/JSME 2011 8th Thermal Engineering Joint Conference. Honolulu, Hawaii, USA. March 13–17, 2011. T30004. ASME. https://doi.org/10.1115/AJTEC2011-44070
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