We have developed a loop thermosyphon for cooling electronics devices. Its cooling performance changes with the ambient temperature and amount of input heating. Especially it deteriorates with non-condensable gas (NCG) increase. NCG leakage of thermosyphon cannot detect below under 10−10 Pa-m3/s, though we have to design the thermosyphon considering these characteristics to provide guaranteed performance for 5–10 years. In this study, the effect of the amount of NCG in each component of a thermosyphon was measured while changing the amount of heater input, and the amount of NCG. As a result, we obtained some useful design information. The performance of air cooling part does not depend on the NCG amount in this case. The performance of evaporation part depends on the total pressure that includes the partial pressure of vapor and the partial pressure of NCG. The performance of condensation part is deteriorated strongly by NCG amount increase. Additionally, we expressed these performances as approximations. These expressions let us predict the total thermal resistance of this thermosyphon by the NCG amount and the input heating amount. Then, using the leakage of a thermosyphon and the amount of dissolved NCG in water, we predicted the amount of NCG that will be in the thermosyphon after 10 years. These results also let us predict the thermosyphon’s total thermal resistance after 10 years. Though there is a slight leakage on thermosyphon, using this technique, we are able to design a thermosyphon that is guaranteed the cooling performance for a long term.
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ASME/JSME 2011 8th Thermal Engineering Joint Conference
March 13–17, 2011
Honolulu, Hawaii, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-3892-1
PROCEEDINGS PAPER
A Design for Loop Thermosyphon Including Effect of Non-Condensable Gas
Hiroyuki Toyoda
,
Hiroyuki Toyoda
Hitachi, Ltd., Hitachinaka, Ibaraki, Japan
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Tadakatsu Nakajima
,
Tadakatsu Nakajima
Hitachi, Ltd., Hitachinaka, Ibaraki, Japan
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Yoshihiro Kondo
,
Yoshihiro Kondo
Hitachi, Ltd., Hitachinaka, Ibaraki, Japan
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Akio Idei
,
Akio Idei
Hitachi, Ltd., Hadano, Kanagawa, Japan
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Shigemasa Sato
Shigemasa Sato
Hitachi, Ltd., Hadano, Kanagawa, Japan
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Hiroyuki Toyoda
Hitachi, Ltd., Hitachinaka, Ibaraki, Japan
Tadakatsu Nakajima
Hitachi, Ltd., Hitachinaka, Ibaraki, Japan
Yoshihiro Kondo
Hitachi, Ltd., Hitachinaka, Ibaraki, Japan
Akio Idei
Hitachi, Ltd., Hadano, Kanagawa, Japan
Shigemasa Sato
Hitachi, Ltd., Hadano, Kanagawa, Japan
Paper No:
AJTEC2011-44244, T10223; 7 pages
Published Online:
March 1, 2011
Citation
Toyoda, H, Nakajima, T, Kondo, Y, Idei, A, & Sato, S. "A Design for Loop Thermosyphon Including Effect of Non-Condensable Gas." Proceedings of the ASME/JSME 2011 8th Thermal Engineering Joint Conference. ASME/JSME 2011 8th Thermal Engineering Joint Conference. Honolulu, Hawaii, USA. March 13–17, 2011. T10223. ASME. https://doi.org/10.1115/AJTEC2011-44244
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