Devices with microchannels or similar structures with dimensions in the range of a few 100 micrometers, so-called microstructured devices, have become a powerful tool in modern process engineering for transferring huge amounts of thermal energy. The high internal surface of these devices, caused by small characteristic channel dimensions, lead to very high specific heat transfer rates. Additional increase of these high heat transfer capabilities is enabled by taking advantage of the latent heat of evaporation. During fundamental research activities phase transition and accompanying phenomena in arrays out of straight microchannels as well as novel microstructures were investigated to obtain new and additional information about these processes. A novel microstructure which is based on a new innovative design away from straight channels is able to enhance evaporation. This design, based on semicircular and semi-elliptical microstructures, leads to mixing effects as well as flow acceleration by pressure release effects including increased heat transfer properties. This novel microstructure reaches highly enhanced evaporation performance compared to linear microchannels.
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ASME/JSME 2011 8th Thermal Engineering Joint Conference
March 13–17, 2011
Honolulu, Hawaii, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-3892-1
PROCEEDINGS PAPER
Efficient Heat Transfer by Phase Transition in Microstructured Devices Available to Purchase
Stefan Maikowske,
Stefan Maikowske
Karlsruhe Institute of Technology (KIT), Eggenstein-Leopoldshafen, Germany
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Juergen J. Brandner,
Juergen J. Brandner
Karlsruhe Institute of Technology (KIT), Eggenstein-Leopoldshafen, Germany
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Roland Dittmeyer
Roland Dittmeyer
Karlsruhe Institute of Technology (KIT), Eggenstein-Leopoldshafen, Germany
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Stefan Maikowske
Karlsruhe Institute of Technology (KIT), Eggenstein-Leopoldshafen, Germany
Juergen J. Brandner
Karlsruhe Institute of Technology (KIT), Eggenstein-Leopoldshafen, Germany
Roland Dittmeyer
Karlsruhe Institute of Technology (KIT), Eggenstein-Leopoldshafen, Germany
Paper No:
AJTEC2011-44116, T10214; 7 pages
Published Online:
March 1, 2011
Citation
Maikowske, S, Brandner, JJ, & Dittmeyer, R. "Efficient Heat Transfer by Phase Transition in Microstructured Devices." Proceedings of the ASME/JSME 2011 8th Thermal Engineering Joint Conference. ASME/JSME 2011 8th Thermal Engineering Joint Conference. Honolulu, Hawaii, USA. March 13–17, 2011. T10214. ASME. https://doi.org/10.1115/AJTEC2011-44116
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