In recent years, since heat dissipation rates and high frequency electronic devices have been increasing, a heat sink with high heat transfer performance is required to cool these devices. Heat sink utilizing micro-channels with several ten microns are expected to provide an excellent cooling performance because of their high heat transfer capacities due to small channel. Therefore, various porous materials such as cellular metals have been investigated for heat sink applications. However, heat sink using conventional porous materials has a high pressure drop because the cooling fluid flow through the pores is complex. Among the described porous materials, a lotus-type porous metal with straight pores is preferable for heat sinks due to the small pressured drop. In present work, cooling performance of the lotus copper heat sink for air cooling and water cooling is introduced. The experimental data for air cooling show 13.2 times higher than that for the conventional groove fins. And, the data for the water cooling show 1.7 times higher than that for the micro-channels. It is concluded that lotus copper heat sink is the most prospective candidate for high power electronics devices.
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ASME/JSME 2011 8th Thermal Engineering Joint Conference
March 13–17, 2011
Honolulu, Hawaii, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-3892-1
PROCEEDINGS PAPER
Development of Heat Sinks for Air Cooling and Water Cooling Using Lotus-Type Porous Metals Available to Purchase
H. Chiba,
H. Chiba
Mitsubishi Electric Corporation, Amagasaki, Hyogo, Japan
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T. Ogushi,
T. Ogushi
Hiroshima International University, Kure, Hiroshima, Japan
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H. Nakajima
H. Nakajima
Osaka University, Ibaraki, Osaka, Japan
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H. Chiba
Mitsubishi Electric Corporation, Amagasaki, Hyogo, Japan
T. Ogushi
Hiroshima International University, Kure, Hiroshima, Japan
H. Nakajima
Osaka University, Ibaraki, Osaka, Japan
Paper No:
AJTEC2011-44108, T10142; 9 pages
Published Online:
March 1, 2011
Citation
Chiba, H, Ogushi, T, & Nakajima, H. "Development of Heat Sinks for Air Cooling and Water Cooling Using Lotus-Type Porous Metals." Proceedings of the ASME/JSME 2011 8th Thermal Engineering Joint Conference. ASME/JSME 2011 8th Thermal Engineering Joint Conference. Honolulu, Hawaii, USA. March 13–17, 2011. T10142. ASME. https://doi.org/10.1115/AJTEC2011-44108
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