Film cooling performance of two hole geometries is evaluated on a flat plate surface with steady-state IR (infrared thermography) technique. The base geometry is a simple cylindrical hole design inclined at 30° from the surface with pitch-to-diameter ratio of 3.0. The second geometry is an anti-vortex design where the two side holes, also of the same diameter, branch out from the root at 15° angle. The pitch-to-diameter ratio is 6.0 between the main holes. The mainstream Reynolds number is 3110 based on the coolant hole diameter. Two secondary fluids — air and carbon-dioxide — were used to study the effects of coolant-to-mainstream density ratio (DR = 0.95 and 1.45) on film cooling effectiveness. Several blowing ratios in the range 0.5 –4.0 were investigated independently at the two density ratios. Results indicate significant improvement in effectiveness with anti-vortex holes compared to cylindrical holes at all the blowing ratios studied. At any given blowing ratio, the anti-vortex hole design uses 50% less coolant and provides at least 30–40% higher cooling effectiveness. The use of relatively dense secondary fluid improves effectiveness immediately downstream of the anti-vortex holes but leads to poor performance downstream.
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ASME/JSME 2011 8th Thermal Engineering Joint Conference
March 13–17, 2011
Honolulu, Hawaii, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-3892-1
PROCEEDINGS PAPER
Film-Cooling Performance of Anti-Vortex Hole on a Flat Plate
Diganta P. Narzary,
Diganta P. Narzary
Virginia Tech University, Blacksburg, VA
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Christopher LeBlanc,
Christopher LeBlanc
Virginia Tech University, Blacksburg, VA
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Srinath Ekkad
Srinath Ekkad
Virginia Tech University, Blacksburg, VA
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Diganta P. Narzary
Virginia Tech University, Blacksburg, VA
Christopher LeBlanc
Virginia Tech University, Blacksburg, VA
Srinath Ekkad
Virginia Tech University, Blacksburg, VA
Paper No:
AJTEC2011-44161, T10077; 9 pages
Published Online:
March 1, 2011
Citation
Narzary, DP, LeBlanc, C, & Ekkad, S. "Film-Cooling Performance of Anti-Vortex Hole on a Flat Plate." Proceedings of the ASME/JSME 2011 8th Thermal Engineering Joint Conference. ASME/JSME 2011 8th Thermal Engineering Joint Conference. Honolulu, Hawaii, USA. March 13–17, 2011. T10077. ASME. https://doi.org/10.1115/AJTEC2011-44161
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