One dimensional (1-D) analytical models are generally used for the evaluation of thermal effusivity of film or substrate in thermoreflectance measurement. However, the range of uncertainties associated with the 1-D assumptions needs to be quantified in order to determine the applicability of 1-D models. In the current study, a two-dimensional (2-D) numerical model was created in a commercial software package, COMSOL, to investigate the difference of results obtained by 1-D or 2-D models. The analysis used a frequency lock-in strategy and the result was verified by a comparison of 1-D numerical simulation to 1-D theoretical values. Parametric studies were performed by considering film thickness, heating laser radius, volumetric heating, thermal resistance between layers, and anisotropic thermal conductivities. The results and conclusions provide a general guidance and reference for the parametric design of thermoreflectance measurements.
Skip Nav Destination
ASME/JSME 2011 8th Thermal Engineering Joint Conference
March 13–17, 2011
Honolulu, Hawaii, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-3892-1
PROCEEDINGS PAPER
Evaluation of Uncertainties of One-Directional Analytical Model for Thermoreflectance Technique
Changhu Xing,
Changhu Xing
Utah State University, Logan, UT
Search for other works by this author on:
David Hurley,
David Hurley
DOE Idaho National Lab, Idaho Falls, ID
Search for other works by this author on:
J. Rory Kennedy
J. Rory Kennedy
DOE Idaho National Lab, Idaho Falls, ID
Search for other works by this author on:
Changhu Xing
Utah State University, Logan, UT
Zilong Hua
Utah State University, Logan, UT
Heng Ban
Utah State University, Logan, UT
David Hurley
DOE Idaho National Lab, Idaho Falls, ID
J. Rory Kennedy
DOE Idaho National Lab, Idaho Falls, ID
Paper No:
AJTEC2011-44539, T10057; 10 pages
Published Online:
March 1, 2011
Citation
Xing, C, Hua, Z, Ban, H, Hurley, D, & Kennedy, JR. "Evaluation of Uncertainties of One-Directional Analytical Model for Thermoreflectance Technique." Proceedings of the ASME/JSME 2011 8th Thermal Engineering Joint Conference. ASME/JSME 2011 8th Thermal Engineering Joint Conference. Honolulu, Hawaii, USA. March 13–17, 2011. T10057. ASME. https://doi.org/10.1115/AJTEC2011-44539
Download citation file:
9
Views
Related Proceedings Papers
Related Articles
Microscale and Nanoscale Thermal Characterization Techniques
J. Electron. Packag (December,2008)
Heat Transfer Across Metal-Dielectric Interfaces During Ultrafast-Laser Heating
J. Heat Transfer (April,2012)
Related Chapters
A Laser Heating Device for Metallographic Studies
Advances in Electron Metallography: Vol. 6
Helping Experts Communicate with Their Public (PSAM-0013)
Proceedings of the Eighth International Conference on Probabilistic Safety Assessment & Management (PSAM)
A Bayesian Approach to Setting Equipment Performance Criteria (PSAM-0438)
Proceedings of the Eighth International Conference on Probabilistic Safety Assessment & Management (PSAM)