Accurate CFD simulation of full vehicle enables vehicle development specialists to gain access to detailed flow and temperature field for the entire vehicle and for arbitrary driving conditions. Information of that nature is invaluable to vehicle development and design since it leads to detailed understanding of the problem areas and pointers to how the design and performance can be improved from the thermal management perspective. Presented are simulations of the vehicle Renault Scenic II cruising at 60 kilometers per hour using PowerFLOW. The simulations were performed using a coupling between the flow solver PowerFLOW and the thermal simulation package PowerTHERM that accounts for conduction and radiation effects. The simulation results were compared with the test data for steady state forced convection case. In order to gauge the accuracy of the simulations, extensive validations were made with thermocouple data and flow measurements. Good agreement was observed between the simulation results and the measurements.
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ASME/JSME 2011 8th Thermal Engineering Joint Conference
March 13–17, 2011
Honolulu, Hawaii, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-3892-1
PROCEEDINGS PAPER
Numerical and Experimental Investigation of Temperature and Flow Field in a Full Vehicle
Devadatta Mukutmoni,
Devadatta Mukutmoni
Exa Corporation, Livonia, MI
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Ales Alajbegovic
Ales Alajbegovic
Exa Corporation, Livonia, MI
Search for other works by this author on:
Devadatta Mukutmoni
Exa Corporation, Livonia, MI
Jaehoon Han
Exa Corporation, Livonia, MI
Ales Alajbegovic
Exa Corporation, Livonia, MI
Paper No:
AJTEC2011-44405, T10048; 9 pages
Published Online:
March 1, 2011
Citation
Mukutmoni, D, Han, J, & Alajbegovic, A. "Numerical and Experimental Investigation of Temperature and Flow Field in a Full Vehicle." Proceedings of the ASME/JSME 2011 8th Thermal Engineering Joint Conference. ASME/JSME 2011 8th Thermal Engineering Joint Conference. Honolulu, Hawaii, USA. March 13–17, 2011. T10048. ASME. https://doi.org/10.1115/AJTEC2011-44405
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