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  • Proceedings Article July 16, 2013

    Mohammad Motalab; Muhannad Mustafa; Jeffrey C. Suhling; Jiawei Zhang; John Evans; Michael J. Bozack; Pradeep Lall

    Proc. ASME. 55751; Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A008.July 16, 2013
    doi: 10.1115/IPACK2013-73230

    TOPICS: Reliability