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  • Proceedings Article July 06, 2015

    Quang Nguyen; M. Kaysar Rahim; Jordan C. Roberts; Jeffrey C. Suhling; Richard C. Jaeger

    Proc. ASME. 56895; Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A041.July 06, 2015
    IPACK2015-48627
    doi: 10.1115/IPACK2015-48627

    TOPICS: Stress
  • Proceedings Article July 06, 2015

    Sudan Ahmed; Munshi Basit; Jeffrey C. Suhling; Pradeep Lall

    Proc. ASME. 56895; Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A003.July 06, 2015
    IPACK2015-48624
    doi: 10.1115/IPACK2015-48624

    TOPICS: Solders
  • Proceedings Article July 16, 2013

    Mohammad Motalab; Muhannad Mustafa; Jeffrey C. Suhling; Jiawei Zhang; John Evans; Michael J. Bozack; Pradeep Lall

    Proc. ASME. 55751; Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A008.July 16, 2013
    IPACK2013-73230
    doi: 10.1115/IPACK2013-73230

    TOPICS: Reliability