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  • Proceedings Article August 29, 2017

    Hyoungsoon Lee; Tanmoy Maitra; James Palko; Chi Zhang; Michael Barako; Yoonjin Won; Mehdi Asheghi; Kenneth E. Goodson

    Proc. ASME. 58097; ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006.August 29, 2017
    IPACK2017-74090
    doi: 10.1115/IPACK2017-74090