0
Electronic & Photonic Packaging
Email Alert
Please Wait... Processing your request... Please Wait.

Journal of Solar Energy Engineering  |  Technical Brief
2017
Sandeep S. Joshi and Ashwinkumar S. Dhoble
J. Sol. Energy Eng 140, 014502 (2017) (9 pages);  doi:10.1115/1.4038052

Journal of Electronic Packaging  |  research-article
2017
Byung-Seung Yim, Young-Eui Shin and Jong-Min Kim
J. Electron. Packag 139, 041007 (2017) (9 pages);  doi:10.1115/1.4038028

Journal of Electronic Packaging  |  research-article
2017
Yasuo Takahashi, Hiroki Fukuda, Yasuhiro Yoneshima, Hideki Kitamura and Masakatsu Maeda
J. Electron. Packag , (2017);  doi:10.1115/1.4038143

Journal of Heat Transfer  |  research-article
2017
Husain Al Hashimi, Caleb F Hammer, Michel Lebon, Dan Zhang and Jungho Kim
J. Heat Transfer , (2017);  doi:10.1115/1.4038135

Journal of Electronic Packaging  |  research-article
2017
A. K. Cousins, G. H. Thiel, E. Wolak, G. Limaye and S. Tiku
J. Electron. Packag 139, 041006 (2017) (7 pages);  doi:10.1115/1.4037971

Journal of Electronic Packaging  |  research-article
2017
Abderrahmane BAÏRI, Bruno Chanetz and José-Antonio Millan-Garcia
J. Electron. Packag , (2017);  doi:10.1115/1.4038113

Journal of Electronic Packaging  |  research-article
2017
Chi-Chuan Wang, Yeng-Yung Tsui and Cheng-Hao Wang
J. Electron. Packag , (2017);  doi:10.1115/1.4038114

Journal of Solar Energy Engineering  |  Technical Brief
2017
Saeed J. Almalowi, AbdulAziz M. AlRaddadi, Mostafa H. AlZughabi, Mazen M. AlHazmi and Mohanned H. Masoudi
J. Sol. Energy Eng 139, 064502 (2017) (3 pages);  doi:10.1115/1.4037904

Journal of Electronic Packaging  |  research-article
2017
John Edward Fernandes, Richard Eiland, Bharath Nagendran, Veerendra Mulay and Dereje Agonafer
J. Electron. Packag , (2017);  doi:10.1115/1.4038014

Journal of Solar Energy Engineering  |  research-article
2017
An Chi Wei, Shih Chieh Lo, Ju-Yi Lee and Hong-Yih Yeh
J. Sol. Energy Eng 139, 061006 (2017) (6 pages);  doi:10.1115/1.4037746

Basic Principles and Potential Applications of Holographic Microwave Imaging  |  Paper
2016
Basic Principles and Potential Applications of Holographic Microwave Imaging Front Matter (2016) (10 pages);  doi:10.1115/1.860434_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
OPEN ACCESS Front Matter
Thermal Management of Microelectronic Equipment, Second Edition Front Matter (2016) (30 pages);  doi:10.1115/1.861097_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Introduction (2016) (14 pages);  doi:10.1115/1.861097_ch1

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Radiation (2016) (14 pages);  doi:10.1115/1.861097_ch4

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Thermal Interface Resistance (2016) (28 pages);  doi:10.1115/1.861097_ch9

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Component and Printed Circuit Board (2016) (16 pages);  doi:10.1115/1.861097_ch10

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Microwave Modules and GaAs Chips (2016) (38 pages);  doi:10.1115/1.861097_ch18

Advances in Computers and Information in Engineering Research, Volume 1  |  Chapter 3
2014
Hammad Mazhar, Toby Heyn, Daniel Melanz, Arman Pazouki, Aaron Bartholomew, Dan Negrut, Paramsothy Jayakumar and Alessandro Tasora
Advances in Computers and Information in Engineering Research, Volume 1 Accelerating Multi-Body Simulation and Visualization with GPU Computing (2014) (25 pages);  doi:10.1115/1.860328_ch3

Thermal Management of Telecommunications Equipment  |  Chapter 1
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Introduction (2013) (4 pages);  doi:10.1115/1.860205_ch1

Thermal Management of Telecommunications Equipment  |  Chapter 2
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Component and Printed Circuit Board (2013) (16 pages);  doi:10.1115/1.860205_ch2

ASME 2017 International Pipeline Geotechnical Conference
2017
Dimas Robles Robles and Einstein Castillo Martínez
IPG2017, pp. V001T03A007- (2017) 11 pages
doi:10.1115/IPG2017-2526

Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems
2017
Benjamin Sponagle, Simon Maranda and Dominic Groulx
HT2017, pp. V001T08A004- (2017) 10 pages
doi:10.1115/HT2017-4801

Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing
2017
Prabodh Panindre and Sunil Kumar
HT2017, pp. V002T15A001- (2017) 8 pages
doi:10.1115/HT2017-4909

Volume 1: Operations and Maintenance, Engineering, Modifications, Life Extension, Life Cycle and Balance of Plant; I&C, Digital Controls, and Influence of Human Factors
2017
Liqiang Wei, Feng Xie, Jian Zheng, Ling Liu and Chuangguo Hu
ICONE25, pp. V001T01A019- (2017) 5 pages
doi:10.1115/ICONE25-66652

Volume 1: Operations and Maintenance, Engineering, Modifications, Life Extension, Life Cycle and Balance of Plant; I&C, Digital Controls, and Influence of Human Factors
2017
Eugene Babeshko, Ievgenii Bakhmach, Vyacheslav Kharchenko, Eugene Ruchkov and Oleksandr Siora
ICONE25, pp. V001T04A026- (2017) 6 pages
doi:10.1115/ICONE25-66862

Volume 2: Plant Systems, Structures, Components and Materials
2017
Haiyan Xu, Donghua Lu, Xiaohang Wu and Qianhua Su
ICONE25, pp. V002T03A096- (2017) 5 pages
doi:10.1115/ICONE25-67359

Volume 2: Plant Systems, Structures, Components and Materials
2017
Zhengang Shi, Jiaji Yang, Ni Mo, Xingnan Liu and Yan Zhou
ICONE25, pp. V002T03A112- (2017) 7 pages
doi:10.1115/ICONE25-67758

Volume 2A: Turbomachinery
2017
Tânia S. Cação Ferreira and Tony Arts
GT2017, pp. V02AT40A010- (2017) 10 pages
doi:10.1115/GT2017-63524

Volume 2C: Turbomachinery
2017
Ricardo Puente, Roque Corral and Jorge Parra
GT2017, pp. V02CT47A027- (2017) 12 pages
doi:10.1115/GT2017-65222

Volume 5B: Heat Transfer
2017
Marwick Sembritzky, Derek Micallef and David Engelmann
GT2017, pp. V05BT22A006- (2017) 11 pages
doi:10.1115/GT2017-63581

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In