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Journal of Solar Energy Engineering  |  Technical Brief
2017
Matthew T. Boyd
J. Sol. Energy Eng 139, 034502 (2017) (7 pages);  doi:10.1115/1.4035830

Journal of Solar Energy Engineering  |  Design Innovation Paper
2017
Brian Dougherty and Matthew Boyd
J. Sol. Energy Eng 139, 035001 (2017) (8 pages);  doi:10.1115/1.4036055

Journal of Solar Energy Engineering  |  research-article
2017
Kristijan Brecl, Matevž Bokalič and Marko Topič
J. Sol. Energy Eng 139, 031011 (2017) (6 pages);  doi:10.1115/1.4036056

Journal of Applied Mechanics  |  Technical Brief
2017
Yuyan Gao, Yuhang Li, Rui Li and Jizhou Song
J. Appl. Mech (2017);  doi:10.1115/1.4036257

Journal of Electronic Packaging  |  Review Article
2017
Yuyan Gao and Huanyu Cheng
J. Electron. Packag (2017);  doi:10.1115/1.4036238

Journal of Electronic Packaging  |  Review Article
2017
Kaysar Rahim and Ahsan Mian
J. Electron. Packag (2017);  doi:10.1115/1.4036239

Journal of Vibration and Acoustics  |  research-article
2017
Lun Liu, Dengqing Cao, Jin Wei, Xiaojun Tan and Tianhu Yu
J. Vib. Acoust (2017);  doi:10.1115/1.4036213

Journal of Electronic Packaging  |  research-article
2017
Jingshi Meng and Abhijit Dasgupta
J. Electron. Packag (2017);  doi:10.1115/1.4036187

Journal of Thermal Science and Engineering Applications  |  research-article
2017
Mark Christian E. Manuel, Kuan Sung Hsu, Shu-Ping Lin and Po Ting Lin
J. Thermal Sci. Eng. Appl 9, 021012 (2017) (9 pages);  doi:10.1115/1.4035837

Journal of Electronic Packaging  |  research-article
2017
Thong Kok Law, Fannon Lim, Yun Li, XuePeng Puan, G.K.E. Sng and Jin Wah Ronnie Teo
J. Electron. Packag (2017);  doi:10.1115/1.4036066

Basic Principles and Potential Applications of Holographic Microwave Imaging  |  Paper
2016
Basic Principles and Potential Applications of Holographic Microwave Imaging Front Matter (2016) (10 pages);  doi:10.1115/1.860434_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
OPEN ACCESS Front Matter
Thermal Management of Microelectronic Equipment, Second Edition Front Matter (2016) (30 pages);  doi:10.1115/1.861097_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Introduction (2016) (14 pages);  doi:10.1115/1.861097_ch1

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Radiation (2016) (14 pages);  doi:10.1115/1.861097_ch4

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Thermal Interface Resistance (2016) (28 pages);  doi:10.1115/1.861097_ch9

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Component and Printed Circuit Board (2016) (16 pages);  doi:10.1115/1.861097_ch10

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Microwave Modules and GaAs Chips (2016) (38 pages);  doi:10.1115/1.861097_ch18

Advances in Computers and Information in Engineering Research, Volume 1  |  Chapter 3
2014
Hammad Mazhar, Toby Heyn, Daniel Melanz, Arman Pazouki, Aaron Bartholomew, Dan Negrut, Paramsothy Jayakumar and Alessandro Tasora
Advances in Computers and Information in Engineering Research, Volume 1 Accelerating Multi-Body Simulation and Visualization with GPU Computing (2014) (25 pages);  doi:10.1115/1.860328_ch3

Thermal Management of Telecommunications Equipment  |  Chapter 1
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Introduction (2013) (4 pages);  doi:10.1115/1.860205_ch1

Thermal Management of Telecommunications Equipment  |  Chapter 2
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Component and Printed Circuit Board (2013) (16 pages);  doi:10.1115/1.860205_ch2

Volume 8: Heat Transfer and Thermal Engineering
2016
Hooman Enayati, Abhilash J. Chandy and Minel J. Braun
IMECE2016, pp. V008T10A052- (2016) 9 pages
doi:10.1115/IMECE2016-66106

Volume 8: Heat Transfer and Thermal Engineering
2016
Mario A. Palacio Vega, Orlando M. González López, Arnold R. Martínez Guarín, Rafael D. Gómez Vásquez, Antonio Bula and Jorge M. Mendoza Fandiño
IMECE2016, pp. V008T10A057- (2016) 8 pages
doi:10.1115/IMECE2016-66769

Volume 8: Heat Transfer and Thermal Engineering
2016
Levi J. Elston
IMECE2016, pp. V008T10A072- (2016) 10 pages
doi:10.1115/IMECE2016-65151

Volume 8: Heat Transfer and Thermal Engineering
2016
Mortaza Saeidijavash, Jivtesh Garg and Bin Wang
IMECE2016, pp. V008T10A104- (2016) 4 pages
doi:10.1115/IMECE2016-66987

Volume 9: Mechanics of Solids, Structures and Fluids; NDE, Diagnosis, and Prognosis
2016
Arnab Chanda, Vinu Unnikrishnan, Holly E. Richter and Mark E. Lockhart
IMECE2016, pp. V009T12A085- (2016) 7 pages
doi:10.1115/IMECE2016-67949

Volume 9: Mechanics of Solids, Structures and Fluids; NDE, Diagnosis, and Prognosis
2016
Franck Mbanya Tchafa, Jun Yao and Haiying Huang
IMECE2016, pp. V009T17A012- (2016) 7 pages
doi:10.1115/IMECE2016-65954

Volume 10: Micro- and Nano-Systems Engineering and Packaging
2016
Jiatong Liu, Ken Suzuki and Hideo Miura
IMECE2016, pp. V010T13A003- (2016) 7 pages
doi:10.1115/IMECE2016-67737

Volume 10: Micro- and Nano-Systems Engineering and Packaging
2016
Bao-Hsin Liu, Yu-Liang Chen and Quang-Cherng Hsu
IMECE2016, pp. V010T13A022- (2016) 6 pages
doi:10.1115/IMECE2016-66773

Volume 10: Micro- and Nano-Systems Engineering and Packaging
2016
M. Jasim Uddin, Glenn Grissom, Miguel Leal, Veronica Galvez, Tarek Trad, Ahmed Touhami, Nazmul Islam, Jason Parsons and H. Justin Moore
IMECE2016, pp. V010T13A032- (2016) 5 pages
doi:10.1115/IMECE2016-67441

Volume 10: Micro- and Nano-Systems Engineering and Packaging
2016
Steven A. Klein, Aleksandar Aleksov, Vijay Subramanian, Rajendra Dias, Pramod Malatkar and Ravi Mahajan
IMECE2016, pp. V010T13A033- (2016) 8 pages
doi:10.1115/IMECE2016-68215

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