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Electronic & Photonic Packaging
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Journal of Electronic Packaging  |  research-article
2019
Nien-Hua Chao and Donald Carlucci
J. Electron. Packag , (2019);  doi:10.1115/1.4042471

Journal of Electronic Packaging  |  research-article
2019
Ali Nematollahisarvestani, Ryan Lewis and Y.C. Lee
J. Electron. Packag , (2019);  doi:10.1115/1.4042472

Journal of Solar Energy Engineering  |  research-article
2019
Shanwen Zhang, Chong Li, Jianfeng Zhang, Hong Miao and Yanjun Zhang
J. Sol. Energy Eng 141, 041001 (2019) (7 pages);  doi:10.1115/1.4042314

Journal of Manufacturing Science and Engineering  |  research-article
2018
Joongeok Kim, Juhee Lim, Changsu Park, Ho Myung, Jongsoo Lee and Shinill Kang
J. Manuf. Sci. Eng 141, 021014 (2018) (9 pages);  doi:10.1115/1.4042125

Journal of Manufacturing Science and Engineering  |  research-article
2018
Marco Marconi, Giacomo Palmieri, Massimo Callegari and Michele Germani
J. Manuf. Sci. Eng 141, 021011 (2018) (8 pages);  doi:10.1115/1.4042006

Journal of Heat Transfer  |  research-article
2018
Sangbeom Cho and Yogendra Joshi
J. Heat Transfer , (2018);  doi:10.1115/1.4042328

Journal of Electronic Packaging  |  research-article
2018
Dylan Patrick McNally, Ryan Lewis and Y.C. Lee
J. Electron. Packag , (2018);  doi:10.1115/1.4042255

Journal of Biomechanical Engineering  |  research-article
2018
Akinjide R. Akintunde, Kathryn M. Robison, Daniel J. Capone, Laurephile Desrosiers, Leise R. Knoepp and Kristin S. Miller
J Biomech Eng 141, 021011 (2018) (11 pages);  doi:10.1115/1.4042014
INCLUDES:  Supplemental Content

Journal of Thermal Science and Engineering Applications  |  research-article
2018
Ercan M. Dede, Yanghe Liu, Shailesh N. Joshi, Feng Zhou, Danny J. Lohan and Jong-Won Shin
J. Thermal Sci. Eng. Appl 11, 021011 (2018) (12 pages);  doi:10.1115/1.4041440

Journal of Solar Energy Engineering  |  research-article
2018
Majid Horoufiany and Reza Ghandhari
J. Sol. Energy Eng 141, 031013 (2018) (7 pages);  doi:10.1115/1.4041930

Proceedings of the 10th International Symposium on Cavitation (CAV2018)  |  Paper
2018
Jin Wang, Cao Zhang and Joseph Katz
Proceedings of the 10th International Symposium on Cavitation (CAV2018) GPU-Based, Parallel-Line, Omni-Directional Integration of the Acceleration Field to Obtain the 3D Pressure Distribution (2018) (4 pages);  doi:10.1115/1.861851_ch93

Proceedings of the 10th International Symposium on Cavitation (CAV2018)  |  Paper
2018
Ece Ozdemir, Berk Ozer, Gokberk Deprem, Ahmad Reza Motezakker, Luis Guillermo Villanueva, Morteza Ghorbani and Ali Koşar
Proceedings of the 10th International Symposium on Cavitation (CAV2018) Hysteresis in Cavitating Flows within Transparent Microchips (2018) (6 pages);  doi:10.1115/1.861851_ch99

Basic Principles and Potential Applications of Holographic Microwave Imaging  |  Paper
2016
Basic Principles and Potential Applications of Holographic Microwave Imaging Front Matter (2016) (10 pages);  doi:10.1115/1.860434_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
PUBLIC ACCESS Front Matter
Thermal Management of Microelectronic Equipment, Second Edition Front Matter (2016) (30 pages);  doi:10.1115/1.861097_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Introduction (2016) (14 pages);  doi:10.1115/1.861097_ch1

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Radiation (2016) (14 pages);  doi:10.1115/1.861097_ch4

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Thermal Interface Resistance (2016) (28 pages);  doi:10.1115/1.861097_ch9

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Component and Printed Circuit Board (2016) (16 pages);  doi:10.1115/1.861097_ch10

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Microwave Modules and GaAs Chips (2016) (38 pages);  doi:10.1115/1.861097_ch18

Advances in Computers and Information in Engineering Research, Volume 1  |  Chapter 3
2014
Hammad Mazhar, Toby Heyn, Daniel Melanz, Arman Pazouki, Aaron Bartholomew, Dan Negrut, Paramsothy Jayakumar and Alessandro Tasora
Advances in Computers and Information in Engineering Research, Volume 1 Accelerating Multi-Body Simulation and Visualization with GPU Computing (2014) (25 pages);  doi:10.1115/1.860328_ch3

Volume 2: Advanced Manufacturing
2018
Rigardt Alfred Maarten Coetzee and Tien-Chien Jen
IMECE2018, pp. V002T02A039- (2018) 9 pages
doi:10.1115/IMECE2018-86401

Volume 2: Advanced Manufacturing
2018
Ricardo F. Oliveira, Nelson Rodrigues, José Carlos Teixeira, Duarte Santos, Delfim Soares, Maria F. Cerqueira and Senhorinha F. C. F. Teixeira
IMECE2018, pp. V002T02A049- (2018) 7 pages
doi:10.1115/IMECE2018-88035

Volume 2: Advanced Manufacturing
2018
Jungyoon Kim, Qingyuan Liu and Tianhong Cui
IMECE2018, pp. V002T02A089- (2018) 5 pages
doi:10.1115/IMECE2018-87918

Volume 6B: Energy
2018
Joshua Smay, Ola Rashwan and James Then
IMECE2018, pp. V06BT08A025- (2018) 7 pages
doi:10.1115/IMECE2018-86858

Volume 6B: Energy
2018
Shah Alam and Rahul Yelamanchili
IMECE2018, pp. V06BT08A026- (2018) 9 pages
doi:10.1115/IMECE2018-86899

Volume 7: Fluids Engineering
2018
Jaber J. Hasbestan and Inanc Senocak
IMECE2018, pp. V007T09A021- (2018) 7 pages
doi:10.1115/IMECE2018-87697

Volume 8B: Heat Transfer and Thermal Engineering
2018
Jose-Carlos Vargas-Vazquez, Jose-Angel Gutierrez-Garcia, Abel Hernandez-Guerrero, Luis Luviano-Ortiz and Jose-Luis Zuñiga-Cerroblanco
IMECE2018, pp. V08BT10A027- (2018) 8 pages
doi:10.1115/IMECE2018-88567

Volume 10: Micro- and Nano-Systems Engineering and Packaging
2018
Kun-Lin Lee, Fang Li, Anis Nurashikin Nordin and Ioana Voiculescu
IMECE2018, pp. V010T13A012- (2018) 6 pages
doi:10.1115/IMECE2018-86436

Volume 10: Micro- and Nano-Systems Engineering and Packaging
2018
Jowesh Avisheik Goundar, Ken Suzuki and Hideo Miura
IMECE2018, pp. V010T13A013- (2018) 7 pages
doi:10.1115/IMECE2018-87245

Volume 12: Materials: Genetics to Structures
2018
Guoxiong Zheng, Yifan Luo and Hideo Miura
IMECE2018, pp. V012T11A004- (2018) 7 pages
doi:10.1115/IMECE2018-87264

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