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Electronic & Photonic Packaging
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Journal of Micro and Nano-Manufacturing  |  Review Article
2018
Yiwei Han and Jingyan Dong
J. Micro Nano-Manuf , (2018);  doi:10.1115/1.4041934

Journal of Engineering for Gas Turbines and Power  |  research-article
2018
Xiao Wei, Guo Zhengyan and Chen Pimin
J. Eng. Gas Turbines Power 141, 021034 (2018) (6 pages);  doi:10.1115/1.4041079

Journal of Electronic Packaging  |  Review Article
2018
Seungkyu Oh, James Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak and Jae-Hyun Ryou
J. Electron. Packag , (2018);  doi:10.1115/1.4041813

Journal of Biomechanical Engineering  |  Technical Brief
2018
Aoife Healy, Kimberley Linyard-Tough and Nachiappan Chockalingam
J Biomech Eng 141, 014501 (2018) (4 pages);  doi:10.1115/1.4041619
INCLUDES:  Supplemental Content

Journal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems  |  research-article
2018
Q. Pan and G. S. Schajer
ASME J Nondestructive Evaluation 2, 011003 (2018) (6 pages);  doi:10.1115/1.4041567

Journal of Computational and Nonlinear Dynamics  |  research-article
2018
Sergio Elaskar and Ezequiel del Río
J. Comput. Nonlinear Dynam 13, 121001 (2018) (10 pages);  doi:10.1115/1.4041577

Journal of Thermal Science and Engineering Applications  |  Technical Brief
2018
Shuo Wang, Peter Shankles, Scott Retterer, Yong Tae Kang and Chang Kyoung Choi
J. Thermal Sci. Eng. Appl 11, 014501 (2018) (3 pages);  doi:10.1115/1.4041436

Journal of Electronic Packaging  |  research-article
2018
Lei Wang, J. Wang and Fei Xiao
J. Electron. Packag , (2018);  doi:10.1115/1.4041714

Journal of Micro and Nano-Manufacturing  |  Technical Brief
2018
Jingwen Yan, Han Wang and Hong Shen
J. Micro Nano-Manuf 6, 044501 (2018) (5 pages);  doi:10.1115/1.4041509

Journal of Electronic Packaging  |  research-article
2018
Yuntao Cui, Yujie Ding, Shuo Xu, Yushu Wang, Wei Rao and Jing Liu
J. Electron. Packag , (2018);  doi:10.1115/1.4041665

Basic Principles and Potential Applications of Holographic Microwave Imaging  |  Paper
2016
Basic Principles and Potential Applications of Holographic Microwave Imaging Front Matter (2016) (10 pages);  doi:10.1115/1.860434_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
PUBLIC ACCESS Front Matter
Thermal Management of Microelectronic Equipment, Second Edition Front Matter (2016) (30 pages);  doi:10.1115/1.861097_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Introduction (2016) (14 pages);  doi:10.1115/1.861097_ch1

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Radiation (2016) (14 pages);  doi:10.1115/1.861097_ch4

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Thermal Interface Resistance (2016) (28 pages);  doi:10.1115/1.861097_ch9

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Component and Printed Circuit Board (2016) (16 pages);  doi:10.1115/1.861097_ch10

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Microwave Modules and GaAs Chips (2016) (38 pages);  doi:10.1115/1.861097_ch18

Advances in Computers and Information in Engineering Research, Volume 1  |  Chapter 3
2014
Hammad Mazhar, Toby Heyn, Daniel Melanz, Arman Pazouki, Aaron Bartholomew, Dan Negrut, Paramsothy Jayakumar and Alessandro Tasora
Advances in Computers and Information in Engineering Research, Volume 1 Accelerating Multi-Body Simulation and Visualization with GPU Computing (2014) (25 pages);  doi:10.1115/1.860328_ch3

Thermal Management of Telecommunications Equipment  |  Chapter 1
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Introduction (2013) (4 pages);  doi:10.1115/1.860205_ch1

Thermal Management of Telecommunications Equipment  |  Chapter 2
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Component and Printed Circuit Board (2013) (16 pages);  doi:10.1115/1.860205_ch2

Volume 1: Advances in Control Design Methods; Advances in Nonlinear Control; Advances in Robotics; Assistive and Rehabilitation Robotics; Automotive Dynamics and Emerging Powertrain Technologies; Automotive Systems; Bio Engineering Applications; Bio-Mechatronics and Physical Human Robot Interaction; Biomedical and Neural Systems; Biomedical and Neural Systems Modeling, Diagnostics, and Healthcare
2018
Hailin Ren, Anil Kumar, Xinran Wang and Pinhas Ben-Tzvi
DSCC2018, pp. V001T07A005- (2018) 7 pages
doi:10.1115/DSCC2018-9007

Volume 2: Control and Optimization of Connected and Automated Ground Vehicles; Dynamic Systems and Control Education; Dynamics and Control of Renewable Energy Systems; Energy Harvesting; Energy Systems; Estimation and Identification; Intelligent Transportation and Vehicles; Manufacturing; Mechatronics; Modeling and Control of IC Engines and Aftertreatment Systems; Modeling and Control of IC Engines and Powertrain Systems; Modeling and Management of Power Systems
2018
Donald J. Docimo, Herschel C. Pangborn and Andrew G. Alleyne
DSCC2018, pp. V002T19A010- (2018) 10 pages
doi:10.1115/DSCC2018-9215

Volume 2B: 44th Design Automation Conference
2018
Umar Farooq Ghumman, Akshay Iyer, Rabindra Dulal, Aaron Wang, Joydeep Munshi, TeYu Chien, Ganesh Balasubramanian and Wei Chen
IDETC/CIE2018, pp. V02BT03A015- (2018) 14 pages
doi:10.1115/DETC2018-86154

Volume 4: 23rd Design for Manufacturing and the Life Cycle Conference; 12th International Conference on Micro- and Nanosystems
2018
Giacomo Palmieri, Marco Marconi, David Corinaldi, Michele Germani and Massimo Callegari
IDETC/CIE2018, pp. V004T05A006- (2018) 9 pages
doi:10.1115/DETC2018-85302

Volume 4: 23rd Design for Manufacturing and the Life Cycle Conference; 12th International Conference on Micro- and Nanosystems
2018
Hamidreza Nafissi, Raafat Mansour and Eihab M. Abdel-Rahman
IDETC/CIE2018, pp. V004T08A015- (2018) 8 pages
doi:10.1115/DETC2018-86428

Volume 4: 23rd Design for Manufacturing and the Life Cycle Conference; 12th International Conference on Micro- and Nanosystems
2018
Fadi Alsaleem, Mohammad H. Hasan, Mehari Tesfay and Mostafa Rafaie
IDETC/CIE2018, pp. V004T08A023- (2018) 8 pages
doi:10.1115/DETC2018-85075

Volume 5B: 42nd Mechanisms and Robotics Conference
2018
Miaomiao Zhang and Brian P. Trease
IDETC/CIE2018, pp. V05BT07A066- (2018) 9 pages
doi:10.1115/DETC2018-86267

Volume 7: 30th International Conference on Design Theory and Methodology
2018
Guanglu Zhang, Douglas Allaire, Daniel A. McAdams and Venkatesh Shankar
IDETC/CIE2018, pp. V007T06A057- (2018) 8 pages
doi:10.1115/DETC2018-85259

ASME 2018 Noise Control and Acoustics Division Session presented at INTERNOISE 2018
2018
Marco Zennaro, Alex Haig, Dan J. O’Boy and Stephen J. Walsh
NCAD2018, pp. V001T08A004- (2018) 6 pages
doi:10.1115/NCAD2018-6125

Volume 3: Nuclear Fuel and Material, Reactor Physics, and Transport Theory
2018
Thomas E. Adams, Shripad T. Revankar, Darrell S. Cheu, Peter Cabauy, Jesse Grant and Bret Elkind
ICONE26, pp. V003T02A056- (2018) 8 pages
doi:10.1115/ICONE26-82475

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