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Electronic & Photonic Packaging
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Journal of Electronic Packaging  |  Errata
2017
Richard C. Jaeger, Mohammad Motalab, Safina Hussain and Jeffrey C. Suhling
J. Electron. Packag , (2017);  doi:10.1115/1.4038735

Journal of Solar Energy Engineering  |  research-article
2017
Bencherif Mohamed and Brahmi Badr -eddine Nabil
J. Sol. Energy Eng , (2017);  doi:10.1115/1.4038620

Journal of Solar Energy Engineering  |  research-article
2017
Zhang Heng, Liu Haowen, Chen Haiping, Guo Xinxin, Liang Kai and Yao Pengbo
J. Sol. Energy Eng , (2017);  doi:10.1115/1.4038621

Journal of Manufacturing Science and Engineering  |  research-article
2017
Mohammad Hossain, Chandra Nath, Thomas M. Tucker, Richard Vuduc and Thomas Kurfess
J. Manuf. Sci. Eng , (2017);  doi:10.1115/1.4038599

Journal of Energy Resources Technology  |  research-article
2017
İrfan Yazıcı and Ersagun Kürşat Yaylacı
J. Energy Resour. Technol 140, 051203 (2017) (6 pages);  doi:10.1115/1.4038485

Journal of Manufacturing Science and Engineering  |  research-article
2017
Ali Gökhan Demir, Chiara De Giorgi and Barbara Previtali
J. Manuf. Sci. Eng , (2017);  doi:10.1115/1.4038568

Journal of Heat Transfer  |  research-article
2017
Robert Glowienko, Hans Derlien, Ozgur Ertunc and Antonio Delgado
J. Heat Transfer , (2017);  doi:10.1115/1.4038547

Journal of Medical Devices  |  research-article
2017
Marit H. N. van Velzen, Arjo J. Loeve, Egbert G. Mik and Sjoerd P. Niehof
J. Med. Devices 12, 011006 (2017) (7 pages);  doi:10.1115/1.4038308

Journal of Solar Energy Engineering  |  Technical Brief
2017
Matthew T. Boyd
J. Sol. Energy Eng 140, 014503 (2017) (6 pages);  doi:10.1115/1.4038314

Journal of Biomechanical Engineering  |  Technical Brief
2017
Boran Zhou, David A. Prim, Eva J. Romito, Liam P. McNamara, Francis G. Spinale, Tarek Shazly and John F. Eberth
J Biomech Eng 140, 014501 (2017) (6 pages);  doi:10.1115/1.4037949

Basic Principles and Potential Applications of Holographic Microwave Imaging  |  Paper
2016
Basic Principles and Potential Applications of Holographic Microwave Imaging Front Matter (2016) (10 pages);  doi:10.1115/1.860434_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
OPEN ACCESS Front Matter
Thermal Management of Microelectronic Equipment, Second Edition Front Matter (2016) (30 pages);  doi:10.1115/1.861097_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Introduction (2016) (14 pages);  doi:10.1115/1.861097_ch1

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Radiation (2016) (14 pages);  doi:10.1115/1.861097_ch4

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Thermal Interface Resistance (2016) (28 pages);  doi:10.1115/1.861097_ch9

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Component and Printed Circuit Board (2016) (16 pages);  doi:10.1115/1.861097_ch10

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Microwave Modules and GaAs Chips (2016) (38 pages);  doi:10.1115/1.861097_ch18

Advances in Computers and Information in Engineering Research, Volume 1  |  Chapter 3
2014
Hammad Mazhar, Toby Heyn, Daniel Melanz, Arman Pazouki, Aaron Bartholomew, Dan Negrut, Paramsothy Jayakumar and Alessandro Tasora
Advances in Computers and Information in Engineering Research, Volume 1 Accelerating Multi-Body Simulation and Visualization with GPU Computing (2014) (25 pages);  doi:10.1115/1.860328_ch3

Thermal Management of Telecommunications Equipment  |  Chapter 1
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Introduction (2013) (4 pages);  doi:10.1115/1.860205_ch1

Thermal Management of Telecommunications Equipment  |  Chapter 2
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Component and Printed Circuit Board (2013) (16 pages);  doi:10.1115/1.860205_ch2

Volume 2: Emissions Control Systems; Instrumentation, Controls, and Hybrids; Numerical Simulation; Engine Design and Mechanical Development
2017
Jian Gao, Ronald O. Grover, Jr., Venkatesh Gopalakrishnan, Ramachandra Diwakar, Wael Elwasif, K. Dean Edwards, Charles E. A. Finney and Russell Whitesides
ICEF2017, pp. V002T06A025- (2017) 7 pages
doi:10.1115/ICEF2017-3631

Volume 1: Aerospace Applications; Advances in Control Design Methods; Bio Engineering Applications; Advances in Non-Linear Control; Adaptive and Intelligent Systems Control; Advances in Wind Energy Systems; Advances in Robotics; Assistive and Rehabilitation Robotics; Biomedical and Neural Systems Modeling, Diagnostics, and Control; Bio-Mechatronics and Physical Human Robot; Advanced Driver Assistance Systems and Autonomous Vehicles; Automotive Systems
2017
Hanie O. Baayoun and Zheng Chen
DSCC2017, pp. V001T25A003- (2017) 8 pages
doi:10.1115/DSCC2017-5078

Volume 2: Mechatronics; Estimation and Identification; Uncertain Systems and Robustness; Path Planning and Motion Control; Tracking Control Systems; Multi-Agent and Networked Systems; Manufacturing; Intelligent Transportation and Vehicles; Sensors and Actuators; Diagnostics and Detection; Unmanned, Ground and Surface Robotics; Motion and Vibration Control Applications
2017
Jeremy J. Dawkins
DSCC2017, pp. V002T04A006- (2017) 5 pages
doi:10.1115/DSCC2017-5273

Volume 2: Mechatronics; Estimation and Identification; Uncertain Systems and Robustness; Path Planning and Motion Control; Tracking Control Systems; Multi-Agent and Networked Systems; Manufacturing; Intelligent Transportation and Vehicles; Sensors and Actuators; Diagnostics and Detection; Unmanned, Ground and Surface Robotics; Motion and Vibration Control Applications
2017
Pratap Bhanu Solanki and Xiaobo Tan
DSCC2017, pp. V002T04A009- (2017) 10 pages
doi:10.1115/DSCC2017-5344

Volume 1: Development and Characterization of Multifunctional Materials; Mechanics and Behavior of Active Materials; Bioinspired Smart Materials and Systems; Energy Harvesting; Emerging Technologies
2017
Chris Marino, Travis M. Hery and Vishnu-Baba Sundaresan
SMASIS2017, pp. V001T08A014- (2017) 5 pages
doi:10.1115/SMASIS2017-3928

Volume 1: Development and Characterization of Multifunctional Materials; Mechanics and Behavior of Active Materials; Bioinspired Smart Materials and Systems; Energy Harvesting; Emerging Technologies
2017
Md Emran Hossain Bhuiyan, Daniel Semer and Brian P. Trease
SMASIS2017, pp. V001T08A016- (2017) 10 pages
doi:10.1115/SMASIS2017-3987

Volume 2: Modeling, Simulation and Control of Adaptive Systems; Integrated System Design and Implementation; Structural Health Monitoring
2017
Aditya Nanda and M. Amin Karami
SMASIS2017, pp. V002T03A029- (2017) 14 pages
doi:10.1115/SMASIS2017-3892

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
2017
Adam Morgan, Leila Choobineh, David Fresne and Douglas C. Hopkins
InterPACK2017, pp. V001T01A002- (2017) 8 pages
doi:10.1115/IPACK2017-74222

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
2017
Hiroki Kikuchi, Kazuhiko Sasagawa and Kazuhiro Fujisaki
InterPACK2017, pp. V001T01A003- (2017) 5 pages
doi:10.1115/IPACK2017-74059

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
2017
Jeremy Plunkett, Suresh Subramaniam, Nokibul Islam, Kang KeonTaek, Gu SeonMo and Eric Ouyang
InterPACK2017, pp. V001T01A008- (2017) 7 pages
doi:10.1115/IPACK2017-74026

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