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Electronic & Photonic Packaging
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Applied Mechanics Reviews  |  Review Article
2017
Yao Yao, Xu Long and Leon M. Keer
Appl. Mech. Rev 69, 040802 (2017) (15 pages);  doi:10.1115/1.4037462

Journal of Electronic Packaging  |  research-article
2017
Richard Eiland, John Fernandes, Marianna Vallejo, Ashwin Siddarth, Dereje Agonafer and Veerendra Mulay
J. Electron. Packag , (2017);  doi:10.1115/1.4037526

Journal of Electronic Packaging  |  research-article
2017
Sung Woo Ma, Chanho Shin and Young-Ho Kim
J. Electron. Packag , (2017);  doi:10.1115/1.4037474

Journal of Computational and Nonlinear Dynamics  |  research-article
2017
Arian Azarang, Mehdi Miri, Sadegh Kamaee and Mohammad Hassan Asemani
J. Comput. Nonlinear Dynam , (2017);  doi:10.1115/1.4037416

Journal of Solar Energy Engineering  |  research-article
2017
Wei-Lin Yang, Po-Hung Chen, Kun-Rui Wu and Likarn Wang
J. Sol. Energy Eng , (2017);  doi:10.1115/1.4037378

Journal of Electronic Packaging  |  research-article
2017
Zihan Wu, Junki Min, Vanessa Smet, Markondeya Raj Pulugurtha, Venky Sundaram and Rao R. Tummala
J. Electron. Packag 139, 041001 (2017) (9 pages);  doi:10.1115/1.4037221

Journal of Electronic Packaging  |  research-article
2017
Huang-Kuang Kung and Chi-Lung Hsieh
J. Electron. Packag 139, 041002 (2017) (8 pages);  doi:10.1115/1.4037276

Journal of Electronic Packaging  |  research-article
2017
Scott McCann, Gregory Ostrowicki, Anh Tran, Timothy Huang, Tobias Bernhard, Rao Tummala and Suresh Sitaraman
J. Electron. Packag , (2017);  doi:10.1115/1.4037334

Journal of Heat Transfer  |  research-article
2017
J. Heat Transfer 139, 122007 (2017) (8 pages);  doi:10.1115/1.4037061

Journal of Electronic Packaging  |  research-article
2017
Rajiv L. Iyer and Daryl L. Santos
J. Electron. Packag 139, 031009 (2017) (10 pages);  doi:10.1115/1.4037144

Basic Principles and Potential Applications of Holographic Microwave Imaging  |  Paper
2016
Basic Principles and Potential Applications of Holographic Microwave Imaging Front Matter (2016) (10 pages);  doi:10.1115/1.860434_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
OPEN ACCESS Front Matter
Thermal Management of Microelectronic Equipment, Second Edition Front Matter (2016) (30 pages);  doi:10.1115/1.861097_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Introduction (2016) (14 pages);  doi:10.1115/1.861097_ch1

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Radiation (2016) (14 pages);  doi:10.1115/1.861097_ch4

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Thermal Interface Resistance (2016) (28 pages);  doi:10.1115/1.861097_ch9

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Component and Printed Circuit Board (2016) (16 pages);  doi:10.1115/1.861097_ch10

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Microwave Modules and GaAs Chips (2016) (38 pages);  doi:10.1115/1.861097_ch18

Advances in Computers and Information in Engineering Research, Volume 1  |  Chapter 3
2014
Hammad Mazhar, Toby Heyn, Daniel Melanz, Arman Pazouki, Aaron Bartholomew, Dan Negrut, Paramsothy Jayakumar and Alessandro Tasora
Advances in Computers and Information in Engineering Research, Volume 1 Accelerating Multi-Body Simulation and Visualization with GPU Computing (2014) (25 pages);  doi:10.1115/1.860328_ch3

Thermal Management of Telecommunications Equipment  |  Chapter 1
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Introduction (2013) (4 pages);  doi:10.1115/1.860205_ch1

Thermal Management of Telecommunications Equipment  |  Chapter 2
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Component and Printed Circuit Board (2013) (16 pages);  doi:10.1115/1.860205_ch2

Volume 2A: Turbomachinery
2017
Tânia S. Cação Ferreira and Tony Arts
GT2017, pp. V02AT40A010- (2017) 10 pages
doi:10.1115/GT2017-63524

Volume 2C: Turbomachinery
2017
Ricardo Puente, Roque Corral and Jorge Parra
GT2017, pp. V02CT47A027- (2017) 12 pages
doi:10.1115/GT2017-65222

Volume 1: Processes
2017
Shalu Bansal, Zhongwei Gao, Chih-hung Chang and Rajiv Malhotra
MSEC2017, pp. V001T02A067- (2017) 9 pages
doi:10.1115/MSEC2017-2739

Volume 2: Additive Manufacturing; Materials
2017
Elham Mirkoohi and Rajiv Malhotra
MSEC2017, pp. V002T01A026- (2017) 6 pages
doi:10.1115/MSEC2017-2811

Volume 3: Manufacturing Equipment and Systems
2017
Zhiqiang Xu, Quan Liu and Zhengying Li
MSEC2017, pp. V003T04A063- (2017) 7 pages
doi:10.1115/MSEC2017-2641

Volume 4: Bio and Sustainable Manufacturing
2017
Jingyi Zhang, Xianfeng Gao, Yelin Deng, Yuanchun Zha and Chris Yuan
MSEC2017, pp. V004T05A021- (2017) 7 pages
doi:10.1115/MSEC2017-2970

Volume 2: Advanced Manufacturing
2016
Shakeel Ahmed L. and Pradeep Kumar M.
IMECE2016, pp. V002T02A008- (2016) 6 pages
doi:10.1115/IMECE2016-66574

Volume 2: Advanced Manufacturing
2016
D. Croccolo, T. M. Brugo, M. De Agostinis, S. Fini and G. Olmi
IMECE2016, pp. V002T02A019- (2016) 10 pages
doi:10.1115/IMECE2016-65489

Volume 2: Advanced Manufacturing
2016
Ana C. Ferreira, Senhorinha F. C. F. Teixeira, Ricardo F. Oliveira, Nelson J. Rodrigues, José C. F. Teixeira and Delfim Soares
IMECE2016, pp. V002T02A024- (2016) 9 pages
doi:10.1115/IMECE2016-66447

Volume 3: Biomedical and Biotechnology Engineering
2016
Ahmed M. Alotaibi, Sohel Anwar, M. Terry Loghmani and Stanley Chien
IMECE2016, pp. V003T04A003- (2016) 9 pages
doi:10.1115/IMECE2016-65268

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