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Electronic & Photonic Packaging
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Journal of Thermal Science and Engineering Applications  |  research-article
2018
Ercan Dede, Yanghe Liu, Shailesh Joshi, Feng Zhou, Danny Lohan and Jong-Won Shin
J. Thermal Sci. Eng. Appl , (2018);  doi:10.1115/1.4041440

Journal of Thermal Science and Engineering Applications  |  research-article
2018
Ivana Fernandes de Sousa, Daduí Cordeiro Guerrieri, Carolina P. Naveira-Cotta and Manish Tiwari
J. Thermal Sci. Eng. Appl , (2018);  doi:10.1115/1.4041439

Journal of Electronic Packaging  |  research-article
2018
J. Electron. Packag 140, 041006 (2018) (8 pages);  doi:10.1115/1.4040978

Journal of Electronic Packaging  |  research-article
2018
Hsien-Chie Cheng, Ruei-You Hong and Wen-Hwa Chen
J. Electron. Packag 140, 041007 (2018) (10 pages);  doi:10.1115/1.4041014

Journal of Electronic Packaging  |  research-article
2018
J. Electron. Packag 140, 041005 (2018) (11 pages);  doi:10.1115/1.4041064

Journal of Mechanical Design  |  research-article
2018
Umar Farooq Ghumman, Akshay Iyer, Rabindra Dulal, Joydeep Munshi, Aaron Wang, TeYu Chien, Ganesh Balasubramanian and Wei Chen
J. Mech. Des 140, 111408 (2018) (14 pages);  doi:10.1115/1.4040912

Journal of Electronic Packaging  |  research-article
2018
Aditya Chandramohan, Sara Lyons, Justin A. Weibel and Dr. Suresh V. Garimella
J. Electron. Packag , (2018);  doi:10.1115/1.4041360

Journal of Electronic Packaging  |  Review Article
2018
Swapnil S. Salvi, Vishal Bhalla, Robert Taylor, Vikrant Khullar, Todd Otanicar, Patrick E. Phelan and Himanshu Tyagi
J. Electron. Packag , (2018);  doi:10.1115/1.4041219

Journal of Electronic Packaging  |  Review Article
2018
Justin Broughton, Vanessa Smet, Rao R. Tummala and Yogendra K. Joshi
J. Electron. Packag 140, 040801 (2018) (11 pages);  doi:10.1115/1.4040828

Journal of Electronic Packaging  |  research-article
2018
Hamoon Azizsoltani and Achintya Haldar
J. Electron. Packag 140, 041003 (2018) (11 pages);  doi:10.1115/1.4040924

Basic Principles and Potential Applications of Holographic Microwave Imaging  |  Paper
2016
Basic Principles and Potential Applications of Holographic Microwave Imaging Front Matter (2016) (10 pages);  doi:10.1115/1.860434_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
PUBLIC ACCESS Front Matter
Thermal Management of Microelectronic Equipment, Second Edition Front Matter (2016) (30 pages);  doi:10.1115/1.861097_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Introduction (2016) (14 pages);  doi:10.1115/1.861097_ch1

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Radiation (2016) (14 pages);  doi:10.1115/1.861097_ch4

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Thermal Interface Resistance (2016) (28 pages);  doi:10.1115/1.861097_ch9

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Component and Printed Circuit Board (2016) (16 pages);  doi:10.1115/1.861097_ch10

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Microwave Modules and GaAs Chips (2016) (38 pages);  doi:10.1115/1.861097_ch18

Advances in Computers and Information in Engineering Research, Volume 1  |  Chapter 3
2014
Hammad Mazhar, Toby Heyn, Daniel Melanz, Arman Pazouki, Aaron Bartholomew, Dan Negrut, Paramsothy Jayakumar and Alessandro Tasora
Advances in Computers and Information in Engineering Research, Volume 1 Accelerating Multi-Body Simulation and Visualization with GPU Computing (2014) (25 pages);  doi:10.1115/1.860328_ch3

Thermal Management of Telecommunications Equipment  |  Chapter 1
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Introduction (2013) (4 pages);  doi:10.1115/1.860205_ch1

Thermal Management of Telecommunications Equipment  |  Chapter 2
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Component and Printed Circuit Board (2013) (16 pages);  doi:10.1115/1.860205_ch2

ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels
2018
Rohit Kothari, Pawan Mahalkar, Santosh K. Sahu and Shailesh I. Kundalwal
ICNMM2018, pp. V001T11A005- (2018) 9 pages
doi:10.1115/ICNMM2018-7732

ASME 2018 Verification and Validation Symposium
2018
Kevin Irick and Nima Fathi
VVS2018, pp. V001T03A002- (2018) 8 pages
doi:10.1115/VVS2018-9317

2018 Design of Medical Devices Conference
2018
David A. Nelson, Saeed I. Latif, Chad Austin and Jeremy Chatham
DMD2018, pp. V001T01A013- (2018) 4 pages
doi:10.1115/DMD2018-6912

Volume 5: Education and Globalization
2017
Michael G. Mauk, Richard Y. Chiou, Shraman Kadapa, Yalcin Ertekin and Tzu-Liang (Bill) Tseng
IMECE2017, pp. V005T06A040- (2017) 8 pages
doi:10.1115/IMECE2017-72264

Volume 7: Fluids Engineering
2017
Flávia V. Barbosa, Pedro E. A. Ribeiro, Maria F. Cerqueira, Delfim F. Soares, José C. F. Teixeira, Senhorinha F. C. F. Teixeira, Rui A. M. M. Lima and Diana M. D. Pinho
IMECE2017, pp. V007T09A035- (2017) 10 pages
doi:10.1115/IMECE2017-71413

Volume 8: Heat Transfer and Thermal Engineering
2017
Tadeh Avanessian and Gisuk Hwang
IMECE2017, pp. V008T10A074- (2017) 8 pages
doi:10.1115/IMECE2017-72663

Volume 10: Micro- and Nano-Systems Engineering and Packaging
2017
Akihiro Goryu, Mitsuaki Kato, Akira Kano, Satoshi Izumi and Kenji Hirohata
IMECE2017, pp. V010T13A019- (2017) 8 pages
doi:10.1115/IMECE2017-72027

Volume 14: Emerging Technologies; Materials: Genetics to Structures; Safety Engineering and Risk Analysis
2017
Richard J. Manley, Dennis G. Gallagher, William W. Hughes, III and Allie M. Pilcher
IMECE2017, pp. V014T07A012- (2017) 7 pages
doi:10.1115/IMECE2017-70026

Volume 14: Emerging Technologies; Materials: Genetics to Structures; Safety Engineering and Risk Analysis
2017
Pedro E. Ribeiro, Delfim F. Soares, Maria F. Cerqueira, Senhorinha F. Teixeira, Daniel A. Barros and José C. Teixeira
IMECE2017, pp. V014T11A020- (2017) 7 pages
doi:10.1115/IMECE2017-71532

Volume 2: Emissions Control Systems; Instrumentation, Controls, and Hybrids; Numerical Simulation; Engine Design and Mechanical Development
2017
Jian Gao, Ronald O. Grover, Jr., Venkatesh Gopalakrishnan, Ramachandra Diwakar, Wael Elwasif, K. Dean Edwards, Charles E. A. Finney and Russell Whitesides
ICEF2017, pp. V002T06A025- (2017) 7 pages
doi:10.1115/ICEF2017-3631

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