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Electronic & Photonic Packaging
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Journal of Electronic Packaging  |  Review Article
2017
Han Zhang and Alan Hedge
J. Electron. Packag , (2017);  doi:10.1115/1.4037146

Journal of Electronic Packaging  |  research-article
2017
Liaw Yowching and Chou Jung-Hua
J. Electron. Packag , (2017);  doi:10.1115/1.4037145

Journal of Electronic Packaging  |  research-article
2017
Rajiv/L Iyer and Santos Daryl L.
J. Electron. Packag , (2017);  doi:10.1115/1.4037144

Journal of Electronic Packaging  |  research-article
2017
Chiara Falsetti, Mirco Magnini and John R. Thome
J. Electron. Packag , (2017);  doi:10.1115/1.4037152

Journal of Biomechanical Engineering  |  research-article
2017
Andersen Michael S., de Zee Mark, Damsgaard Michael, Nolte Daniel and Rasmussen John
J Biomech Eng , (2017);  doi:10.1115/1.4037100

Journal of Manufacturing Science and Engineering  |  research-article
2017
Xiaochi Xu, Chaitanya Krishna Prasad Vallabh, Zachary James Cleland and Cetin Cetinkaya
J. Manuf. Sci. Eng 139, 091001 (2017) (12 pages);  doi:10.1115/1.4036908

Journal of Heat Transfer  |  research-article
2017
Fraj Echouchene and Hafedh Belmabrouk
J. Heat Transfer , (2017);  doi:10.1115/1.4037061

Journal of Electronic Packaging  |  research-article
2017
Jingshi Meng and Abhijit Dasgupta
J. Electron. Packag 139, 031001 (2017) (12 pages);  doi:10.1115/1.4036187

Journal of Electronic Packaging  |  Review Article
2017
Kaysar Rahim and Ahsan Mian
J. Electron. Packag 139, 030801 (2017) (11 pages);  doi:10.1115/1.4036239

Journal of Electronic Packaging  |  research-article
2017
Joel Thambi, Andreas Schiessl, Manuela Waltz, Klaus-Dieter Lang and Ulrich Tetzlaff
J. Electron. Packag 139, 031002 (2017) (10 pages);  doi:10.1115/1.4035850

Basic Principles and Potential Applications of Holographic Microwave Imaging  |  Paper
2016
Basic Principles and Potential Applications of Holographic Microwave Imaging Front Matter (2016) (10 pages);  doi:10.1115/1.860434_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
OPEN ACCESS Front Matter
Thermal Management of Microelectronic Equipment, Second Edition Front Matter (2016) (30 pages);  doi:10.1115/1.861097_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Introduction (2016) (14 pages);  doi:10.1115/1.861097_ch1

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Radiation (2016) (14 pages);  doi:10.1115/1.861097_ch4

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Thermal Interface Resistance (2016) (28 pages);  doi:10.1115/1.861097_ch9

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Component and Printed Circuit Board (2016) (16 pages);  doi:10.1115/1.861097_ch10

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Microwave Modules and GaAs Chips (2016) (38 pages);  doi:10.1115/1.861097_ch18

Advances in Computers and Information in Engineering Research, Volume 1  |  Chapter 3
2014
Hammad Mazhar, Toby Heyn, Daniel Melanz, Arman Pazouki, Aaron Bartholomew, Dan Negrut, Paramsothy Jayakumar and Alessandro Tasora
Advances in Computers and Information in Engineering Research, Volume 1 Accelerating Multi-Body Simulation and Visualization with GPU Computing (2014) (25 pages);  doi:10.1115/1.860328_ch3

Thermal Management of Telecommunications Equipment  |  Chapter 1
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Introduction (2013) (4 pages);  doi:10.1115/1.860205_ch1

Thermal Management of Telecommunications Equipment  |  Chapter 2
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Component and Printed Circuit Board (2013) (16 pages);  doi:10.1115/1.860205_ch2

Volume 2: Advanced Manufacturing
2016
Shakeel Ahmed L. and Pradeep Kumar M.
IMECE2016, pp. V002T02A008- (2016) 6 pages
doi:10.1115/IMECE2016-66574

Volume 2: Advanced Manufacturing
2016
D. Croccolo, T. M. Brugo, M. De Agostinis, S. Fini and G. Olmi
IMECE2016, pp. V002T02A019- (2016) 10 pages
doi:10.1115/IMECE2016-65489

Volume 2: Advanced Manufacturing
2016
Ana C. Ferreira, Senhorinha F. C. F. Teixeira, Ricardo F. Oliveira, Nelson J. Rodrigues, José C. F. Teixeira and Delfim Soares
IMECE2016, pp. V002T02A024- (2016) 9 pages
doi:10.1115/IMECE2016-66447

Volume 3: Biomedical and Biotechnology Engineering
2016
Ahmed M. Alotaibi, Sohel Anwar, M. Terry Loghmani and Stanley Chien
IMECE2016, pp. V003T04A003- (2016) 9 pages
doi:10.1115/IMECE2016-65268

Volume 5: Education and Globalization
2016
K. McCall Barger and Christopher A. Mattson
IMECE2016, pp. V005T06A025- (2016) 6 pages
doi:10.1115/IMECE2016-65647

Volume 8: Heat Transfer and Thermal Engineering
2016
Hooman Enayati, Abhilash J. Chandy and Minel J. Braun
IMECE2016, pp. V008T10A052- (2016) 9 pages
doi:10.1115/IMECE2016-66106

Volume 8: Heat Transfer and Thermal Engineering
2016
Mario A. Palacio Vega, Orlando M. González López, Arnold R. Martínez Guarín, Rafael D. Gómez Vásquez, Antonio Bula and Jorge M. Mendoza Fandiño
IMECE2016, pp. V008T10A057- (2016) 8 pages
doi:10.1115/IMECE2016-66769

Volume 8: Heat Transfer and Thermal Engineering
2016
Levi J. Elston
IMECE2016, pp. V008T10A072- (2016) 10 pages
doi:10.1115/IMECE2016-65151

Volume 8: Heat Transfer and Thermal Engineering
2016
Mortaza Saeidijavash, Jivtesh Garg and Bin Wang
IMECE2016, pp. V008T10A104- (2016) 4 pages
doi:10.1115/IMECE2016-66987

Volume 9: Mechanics of Solids, Structures and Fluids; NDE, Diagnosis, and Prognosis
2016
Arnab Chanda, Vinu Unnikrishnan, Holly E. Richter and Mark E. Lockhart
IMECE2016, pp. V009T12A085- (2016) 7 pages
doi:10.1115/IMECE2016-67949

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