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Electronic & Photonic Packaging
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Journal of Electronic Packaging  |  research-article
2017
Steven A. Klein, Aleksandar Aleksov, Vijay Subramanian, Pramod Malatkar and Ravi Mahajan
J. Electron. Packag 139, 021004 (2017) (7 pages);  doi:10.1115/1.4036389

Journal of Mechanical Design  |  research-article
2017
Shuangcheng Yu, Yichi Zhang, Chen Wang, Won-kyu Lee, Biqin Dong, Teri W. Odom, Cheng Sun and Wei Chen
J. Mech. Des (2017);  doi:10.1115/1.4036582

Journal of Electronic Packaging  |  research-article
2017
Jimil M. Shah, Oluwaseun Awe, Betsegaw Gebrehiwot, Dereje Agonafer, Prabjit Singh, Naveen Kannan and Mike Kaler
J. Electron. Packag 139, 021002 (2017) (11 pages);  doi:10.1115/1.4036363

Journal of Electronic Packaging  |  research-article
2017
Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Tsgereda Alazar, Sivakumar Yagnamurthy, Edvin Cetegen, David McCoy and Pramod Malatkar
J. Electron. Packag 139, 021003 (2017) (11 pages);  doi:10.1115/1.4036356

Journal of Nuclear Engineering and Radiation Science  |  research-article
2017
Hiroo Kondo, Takuji Kanemura, Tomohiro Furukawa, Yasushi Hirakawa, Eiichi Wakai and Juan Knaster
ASME J of Nuclear Rad Sci (2017);  doi:10.1115/1.4036513

Journal of Vibration and Acoustics  |  Technical Brief
2017
Hanbo Jiang, Alex Siu Hong Lau and Xun Huang
J. Vib. Acoust (2017);  doi:10.1115/1.4036471

Journal of Applied Mechanics  |  Technical Brief
2017
Yuyan Gao, Yuhang Li, Rui Li and Jizhou Song
J. Appl. Mech 84, 064501 (2017) (4 pages);  doi:10.1115/1.4036257

Journal of Electronic Packaging  |  research-article
2017
Srivathsan Sudhakar and Justin A. Weibel
J. Electron. Packag 139, 021001 (2017) (7 pages);  doi:10.1115/1.4036065

Journal of Electronic Packaging  |  research-article
2017
Takeru Kato, Ken Suzuki and Hideo Miura
J. Electron. Packag (2017);  doi:10.1115/1.4036442

Journal of Manufacturing Science and Engineering  |  research-article
2017
Hongyue Sun, Kan Wang, Yifu Li, Chuck Zhang and Ran Jin
J. Manuf. Sci. Eng 139, 071012 (2017) (10 pages);  doi:10.1115/1.4035586

Basic Principles and Potential Applications of Holographic Microwave Imaging  |  Paper
2016
Basic Principles and Potential Applications of Holographic Microwave Imaging Front Matter (2016) (10 pages);  doi:10.1115/1.860434_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
OPEN ACCESS Front Matter
Thermal Management of Microelectronic Equipment, Second Edition Front Matter (2016) (30 pages);  doi:10.1115/1.861097_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Introduction (2016) (14 pages);  doi:10.1115/1.861097_ch1

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Radiation (2016) (14 pages);  doi:10.1115/1.861097_ch4

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Thermal Interface Resistance (2016) (28 pages);  doi:10.1115/1.861097_ch9

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Component and Printed Circuit Board (2016) (16 pages);  doi:10.1115/1.861097_ch10

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Microwave Modules and GaAs Chips (2016) (38 pages);  doi:10.1115/1.861097_ch18

Advances in Computers and Information in Engineering Research, Volume 1  |  Chapter 3
2014
Hammad Mazhar, Toby Heyn, Daniel Melanz, Arman Pazouki, Aaron Bartholomew, Dan Negrut, Paramsothy Jayakumar and Alessandro Tasora
Advances in Computers and Information in Engineering Research, Volume 1 Accelerating Multi-Body Simulation and Visualization with GPU Computing (2014) (25 pages);  doi:10.1115/1.860328_ch3

Thermal Management of Telecommunications Equipment  |  Chapter 1
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Introduction (2013) (4 pages);  doi:10.1115/1.860205_ch1

Thermal Management of Telecommunications Equipment  |  Chapter 2
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Component and Printed Circuit Board (2013) (16 pages);  doi:10.1115/1.860205_ch2

Volume 5: Education and Globalization
2016
K. McCall Barger and Christopher A. Mattson
IMECE2016, pp. V005T06A025- (2016) 6 pages
doi:10.1115/IMECE2016-65647

Volume 8: Heat Transfer and Thermal Engineering
2016
Hooman Enayati, Abhilash J. Chandy and Minel J. Braun
IMECE2016, pp. V008T10A052- (2016) 9 pages
doi:10.1115/IMECE2016-66106

Volume 8: Heat Transfer and Thermal Engineering
2016
Mario A. Palacio Vega, Orlando M. González López, Arnold R. Martínez Guarín, Rafael D. Gómez Vásquez, Antonio Bula and Jorge M. Mendoza Fandiño
IMECE2016, pp. V008T10A057- (2016) 8 pages
doi:10.1115/IMECE2016-66769

Volume 8: Heat Transfer and Thermal Engineering
2016
Levi J. Elston
IMECE2016, pp. V008T10A072- (2016) 10 pages
doi:10.1115/IMECE2016-65151

Volume 8: Heat Transfer and Thermal Engineering
2016
Mortaza Saeidijavash, Jivtesh Garg and Bin Wang
IMECE2016, pp. V008T10A104- (2016) 4 pages
doi:10.1115/IMECE2016-66987

Volume 9: Mechanics of Solids, Structures and Fluids; NDE, Diagnosis, and Prognosis
2016
Arnab Chanda, Vinu Unnikrishnan, Holly E. Richter and Mark E. Lockhart
IMECE2016, pp. V009T12A085- (2016) 7 pages
doi:10.1115/IMECE2016-67949

Volume 9: Mechanics of Solids, Structures and Fluids; NDE, Diagnosis, and Prognosis
2016
Franck Mbanya Tchafa, Jun Yao and Haiying Huang
IMECE2016, pp. V009T17A012- (2016) 7 pages
doi:10.1115/IMECE2016-65954

Volume 10: Micro- and Nano-Systems Engineering and Packaging
2016
Jiatong Liu, Ken Suzuki and Hideo Miura
IMECE2016, pp. V010T13A003- (2016) 7 pages
doi:10.1115/IMECE2016-67737

Volume 10: Micro- and Nano-Systems Engineering and Packaging
2016
Bao-Hsin Liu, Yu-Liang Chen and Quang-Cherng Hsu
IMECE2016, pp. V010T13A022- (2016) 6 pages
doi:10.1115/IMECE2016-66773

Volume 10: Micro- and Nano-Systems Engineering and Packaging
2016
M. Jasim Uddin, Glenn Grissom, Miguel Leal, Veronica Galvez, Tarek Trad, Ahmed Touhami, Nazmul Islam, Jason Parsons and H. Justin Moore
IMECE2016, pp. V010T13A032- (2016) 5 pages
doi:10.1115/IMECE2016-67441

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