0
Electronic & Photonic Packaging
Email Alert
Please Wait... Processing your request... Please Wait.

Journal of Micro and Nano-Manufacturing  |  research-article
2018
Hao Xin, Qishen Zhao, Dongmei Chen and Wei Li
J. Micro Nano-Manuf 6, 031004 (2018) (7 pages);  doi:10.1115/1.4040449

Journal of Electronic Packaging  |  research-article
2018
Bryce DeFigueiredo, Trent Zimmerman, Brian Russell and Larry L Howell
J. Electron. Packag , (2018);  doi:10.1115/1.4040552

Journal of Electronic Packaging  |  research-article
2018
Ye Tian, Ning Ren, Xiaoxia Jian, Tie Geng and Yiping Wu
J. Electron. Packag 140, 031007 (2018) (5 pages);  doi:10.1115/1.4040298

Journal of Electronic Packaging  |  research-article
2018
Tingting Zhang, Bahgat G. Sammakia, Zhihao Yang and Howard Wang
J. Electron. Packag 140, 031006 (2018) (8 pages);  doi:10.1115/1.4040204

Journal of Electronic Packaging  |  research-article
2018
Liang Yin, Chris Kapusta, Arun V. Gowda and Kaustubh Nagarkar
J. Electron. Packag , (2018);  doi:10.1115/1.4040499

Journal of Electronic Packaging  |  research-article
2018
Sinan Su, Nianjun Fu, Francy John Akkara and Sa'd Hamasha
J. Electron. Packag 140, 031005 (2018) (9 pages);  doi:10.1115/1.4040105

Journal of Manufacturing Science and Engineering  |  research-article
2018
Hossein Paktinat and Saeid Amini
J. Manuf. Sci. Eng , (2018);  doi:10.1115/1.4040321

Journal of Electronic Packaging  |  research-article
2018
Chia-Cheng Chang, Sheng-Da Lin and Kuo-Ning Chiang
J. Electron. Packag , (2018);  doi:10.1115/1.4040297

Journal of Electronic Packaging  |  research-article
2018
Fumihiro Inoue, Anne Jourdain, Lan Peng, Alain Phommahaxay, Daisuke Kosemura, Ingrid De Wolf, Kenneth June Rebibis, Andy Miller, Erik Sleeckx and Eric Beyne
J. Electron. Packag 140, 031004 (2018) (6 pages);  doi:10.1115/1.4040002

Journal of Electronic Packaging  |  research-article
2018
Aaron Knobloch, Chris Kapusta, Jason Karp, Yuri Plotnikov, Jason B. Siegel and Anna G. Stefanopoulou
J. Electron. Packag 140, 031002 (2018) (8 pages);  doi:10.1115/1.4039861

Basic Principles and Potential Applications of Holographic Microwave Imaging  |  Paper
2016
Basic Principles and Potential Applications of Holographic Microwave Imaging Front Matter (2016) (10 pages);  doi:10.1115/1.860434_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
PUBLIC ACCESS Front Matter
Thermal Management of Microelectronic Equipment, Second Edition Front Matter (2016) (30 pages);  doi:10.1115/1.861097_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Introduction (2016) (14 pages);  doi:10.1115/1.861097_ch1

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Radiation (2016) (14 pages);  doi:10.1115/1.861097_ch4

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Thermal Interface Resistance (2016) (28 pages);  doi:10.1115/1.861097_ch9

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Component and Printed Circuit Board (2016) (16 pages);  doi:10.1115/1.861097_ch10

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Microwave Modules and GaAs Chips (2016) (38 pages);  doi:10.1115/1.861097_ch18

Advances in Computers and Information in Engineering Research, Volume 1  |  Chapter 3
2014
Hammad Mazhar, Toby Heyn, Daniel Melanz, Arman Pazouki, Aaron Bartholomew, Dan Negrut, Paramsothy Jayakumar and Alessandro Tasora
Advances in Computers and Information in Engineering Research, Volume 1 Accelerating Multi-Body Simulation and Visualization with GPU Computing (2014) (25 pages);  doi:10.1115/1.860328_ch3

Thermal Management of Telecommunications Equipment  |  Chapter 1
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Introduction (2013) (4 pages);  doi:10.1115/1.860205_ch1

Thermal Management of Telecommunications Equipment  |  Chapter 2
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Component and Printed Circuit Board (2013) (16 pages);  doi:10.1115/1.860205_ch2

 1-20 of 1311 Articles
2018 Design of Medical Devices Conference
2018
David A. Nelson, Saeed I. Latif, Chad Austin and Jeremy Chatham
DMD2018, pp. V001T01A013- (2018) 4 pages
doi:10.1115/DMD2018-6912

Volume 5: Education and Globalization
2017
Michael G. Mauk, Richard Y. Chiou, Shraman Kadapa, Yalcin Ertekin and Tzu-Liang (Bill) Tseng
IMECE2017, pp. V005T06A040- (2017) 8 pages
doi:10.1115/IMECE2017-72264

Volume 7: Fluids Engineering
2017
Flávia V. Barbosa, Pedro E. A. Ribeiro, Maria F. Cerqueira, Delfim F. Soares, José C. F. Teixeira, Senhorinha F. C. F. Teixeira, Rui A. M. M. Lima and Diana M. D. Pinho
IMECE2017, pp. V007T09A035- (2017) 10 pages
doi:10.1115/IMECE2017-71413

Volume 8: Heat Transfer and Thermal Engineering
2017
Tadeh Avanessian and Gisuk Hwang
IMECE2017, pp. V008T10A074- (2017) 8 pages
doi:10.1115/IMECE2017-72663

Volume 10: Micro- and Nano-Systems Engineering and Packaging
2017
Akihiro Goryu, Mitsuaki Kato, Akira Kano, Satoshi Izumi and Kenji Hirohata
IMECE2017, pp. V010T13A019- (2017) 8 pages
doi:10.1115/IMECE2017-72027

Volume 14: Emerging Technologies; Materials: Genetics to Structures; Safety Engineering and Risk Analysis
2017
Richard J. Manley, Dennis G. Gallagher, William W. Hughes, III and Allie M. Pilcher
IMECE2017, pp. V014T07A012- (2017) 7 pages
doi:10.1115/IMECE2017-70026

Volume 14: Emerging Technologies; Materials: Genetics to Structures; Safety Engineering and Risk Analysis
2017
Pedro E. Ribeiro, Delfim F. Soares, Maria F. Cerqueira, Senhorinha F. Teixeira, Daniel A. Barros and José C. Teixeira
IMECE2017, pp. V014T11A020- (2017) 7 pages
doi:10.1115/IMECE2017-71532

Volume 2: Emissions Control Systems; Instrumentation, Controls, and Hybrids; Numerical Simulation; Engine Design and Mechanical Development
2017
Jian Gao, Ronald O. Grover, Jr., Venkatesh Gopalakrishnan, Ramachandra Diwakar, Wael Elwasif, K. Dean Edwards, Charles E. A. Finney and Russell Whitesides
ICEF2017, pp. V002T06A025- (2017) 7 pages
doi:10.1115/ICEF2017-3631

Volume 1: Aerospace Applications; Advances in Control Design Methods; Bio Engineering Applications; Advances in Non-Linear Control; Adaptive and Intelligent Systems Control; Advances in Wind Energy Systems; Advances in Robotics; Assistive and Rehabilitation Robotics; Biomedical and Neural Systems Modeling, Diagnostics, and Control; Bio-Mechatronics and Physical Human Robot; Advanced Driver Assistance Systems and Autonomous Vehicles; Automotive Systems
2017
Hanie O. Baayoun and Zheng Chen
DSCC2017, pp. V001T25A003- (2017) 8 pages
doi:10.1115/DSCC2017-5078

Volume 2: Mechatronics; Estimation and Identification; Uncertain Systems and Robustness; Path Planning and Motion Control; Tracking Control Systems; Multi-Agent and Networked Systems; Manufacturing; Intelligent Transportation and Vehicles; Sensors and Actuators; Diagnostics and Detection; Unmanned, Ground and Surface Robotics; Motion and Vibration Control Applications
2017
Jeremy J. Dawkins
DSCC2017, pp. V002T04A006- (2017) 5 pages
doi:10.1115/DSCC2017-5273

Volume 2: Mechatronics; Estimation and Identification; Uncertain Systems and Robustness; Path Planning and Motion Control; Tracking Control Systems; Multi-Agent and Networked Systems; Manufacturing; Intelligent Transportation and Vehicles; Sensors and Actuators; Diagnostics and Detection; Unmanned, Ground and Surface Robotics; Motion and Vibration Control Applications
2017
Pratap Bhanu Solanki and Xiaobo Tan
DSCC2017, pp. V002T04A009- (2017) 10 pages
doi:10.1115/DSCC2017-5344

Volume 1: Development and Characterization of Multifunctional Materials; Mechanics and Behavior of Active Materials; Bioinspired Smart Materials and Systems; Energy Harvesting; Emerging Technologies
2017
Chris Marino, Travis M. Hery and Vishnu-Baba Sundaresan
SMASIS2017, pp. V001T08A014- (2017) 5 pages
doi:10.1115/SMASIS2017-3928

Volume 1: Development and Characterization of Multifunctional Materials; Mechanics and Behavior of Active Materials; Bioinspired Smart Materials and Systems; Energy Harvesting; Emerging Technologies
2017
Md Emran Hossain Bhuiyan, Daniel Semer and Brian P. Trease
SMASIS2017, pp. V001T08A016- (2017) 10 pages
doi:10.1115/SMASIS2017-3987

Volume 2: Modeling, Simulation and Control of Adaptive Systems; Integrated System Design and Implementation; Structural Health Monitoring
2017
Aditya Nanda and M. Amin Karami
SMASIS2017, pp. V002T03A029- (2017) 14 pages
doi:10.1115/SMASIS2017-3892

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
2017
Adam Morgan, Leila Choobineh, David Fresne and Douglas C. Hopkins
InterPACK2017, pp. V001T01A002- (2017) 8 pages
doi:10.1115/IPACK2017-74222

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
2017
Hiroki Kikuchi, Kazuhiko Sasagawa and Kazuhiro Fujisaki
InterPACK2017, pp. V001T01A003- (2017) 5 pages
doi:10.1115/IPACK2017-74059

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
2017
Jeremy Plunkett, Suresh Subramaniam, Nokibul Islam, Kang KeonTaek, Gu SeonMo and Eric Ouyang
InterPACK2017, pp. V001T01A008- (2017) 7 pages
doi:10.1115/IPACK2017-74026

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
2017
Qian Jiang, Abhishek Deshpande and Abhijit Dasgupta
InterPACK2017, pp. V001T01A009- (2017) 5 pages
doi:10.1115/IPACK2017-74133

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
2017
Nianjun Fu, Jing Wu, Sudan Ahmed, Jeffrey C. Suhling and Pradeep Lall
InterPACK2017, pp. V001T01A010- (2017) 11 pages
doi:10.1115/IPACK2017-74266

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
2017
Jing Wang, Yuling Niu and Seungbae Park
InterPACK2017, pp. V001T01A011- (2017) 8 pages
doi:10.1115/IPACK2017-74017

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In