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Electronic & Photonic Packaging
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 1-20 of 1965 Articles
Journal of Manufacturing Science and Engineering  |  research-article
2018
Hossein Paktinat and Saeid Amini
J. Manuf. Sci. Eng , (2018);  doi:10.1115/1.4040321

Journal of Electronic Packaging  |  research-article
2018
Chia-Cheng Chang, Sheng-Da Lin and Kuo-Ning Chiang
J. Electron. Packag , (2018);  doi:10.1115/1.4040297

Journal of Electronic Packaging  |  research-article
2018
Ye Tian, Ning Ren, Xiaoxia Jian, Tie Geng and Yiping Wu
J. Electron. Packag , (2018);  doi:10.1115/1.4040298

Journal of Electronic Packaging  |  research-article
2018
Aaron Knobloch, Chris Kapusta, Jason Karp, Yuri Plotnikov, Jason B. Siegel and Anna G. Stefanopoulou
J. Electron. Packag 140, 031002 (2018) (8 pages);  doi:10.1115/1.4039861

Journal of Electronic Packaging  |  research-article
2018
Fumihiro Inoue, Anne Jourdain, Lan Peng, Alain Phommahaxay, Daisuke Kosemura, Ingrid De Wolf, Kenneth June Rebibis, Andy Miller, Erik Sleeckx and Eric Beyne
J. Electron. Packag 140, 031004 (2018) (6 pages);  doi:10.1115/1.4040002

Journal of Electronic Packaging  |  research-article
2018
Raphael K. Mandel, Daniel G. Bae and Michael M. Ohadi
J. Electron. Packag 140, 031003 (2018) (10 pages);  doi:10.1115/1.4039264

Journal of Electronic Packaging  |  research-article
2018
Ž. Staliulionis, H. Conseil-Gudla, S. Mohanty, M. Jabbari, R. Ambat and J. H. Hattel
J. Electron. Packag 140, 031001 (2018) (11 pages);  doi:10.1115/1.4039790

Journal of Electronic Packaging  |  research-article
2018
Paul T. Vianco, Alice C. Kilgo and Bonnie M. McKenzie
J. Electron. Packag 140, 021003 (2018) (18 pages);  doi:10.1115/1.4039749

Journal of Electronic Packaging  |  Editorial
2018
J. Electron. Packag 140, 020201 (2018) (2 pages);  doi:10.1115/1.4039660

Journal of Electronic Packaging  |  research-article
2018
Filippo Cataldo and John Richard Thome
J. Electron. Packag 140, 021002 (2018) (11 pages);  doi:10.1115/1.4039706

Journal of Electronic Packaging  |  research-article
2018
Karumbu Meyyappan, Milena Vujosevic, Qifeng Wu, Pramod Malatkar, Charles Hill and Ryan Parrott
J. Electron. Packag 140, 020905 (2018) (12 pages);  doi:10.1115/1.4039301

Journal of Electronic Packaging  |  research-article
2018
Chirag R. Kharangate, Ki Wook Jung, Sangwoo Jung, Daeyoung Kong, Joseph Schaadt, Madhusudan Iyengar, Chris Malone, Hyoungsoon Lee, Mehdi Asheghi and Kenneth E. Goodson
J. Electron. Packag 140, 021001 (2018) (12 pages);  doi:10.1115/1.4039475

Journal of Electronic Packaging  |  research-article
2018
Hyoungsoon Lee, Tanmoy Maitra, James Palko, Daeyoung Kong, Chi Zhang, Michael T. Barako, Yoonjin Won, Mehdi Asheghi and Kenneth E. Goodson
J. Electron. Packag 140, 020906 (2018) (6 pages);  doi:10.1115/1.4040088

Journal of Electronic Packaging  |  Guest Editorial
2018
Kaushik Mysore, Sreekant Narumanchi, Ercan Dede and Reza Khiabani
J. Electron. Packag 140, 020301 (2018) (1 page);  doi:10.1115/1.4039963

Journal of Electronic Packaging  |  research-article
2018
Tahany I. El-Wardany, Ying She, Vijay N. Jagdale, Jacquelynn K. Garofano, Joe J. Liou and Wayde R. Schmidt
J. Electron. Packag 140, 020907 (2018) (12 pages);  doi:10.1115/1.4039974

Journal of Electronic Packaging  |  research-article
2018
Hannes Greve, S. Ali Moeini, Patrick McCluskey and Shailesh Joshi
J. Electron. Packag 140, 020903 (2018) (9 pages);  doi:10.1115/1.4039265

Journal of Electronic Packaging  |  research-article
2018
Pavan Kumar Vaitheeswaran and Ganesh Subbarayan
J. Electron. Packag 140, 020901 (2018) (7 pages);  doi:10.1115/1.4039136

Journal of Electronic Packaging  |  research-article
2018
Sami Alkharabsheh, Udaya L. N. Puvvadi, Bharath Ramakrishnan, Kanad Ghose and Bahgat Sammakia
J. Electron. Packag 140, 020902 (2018) (8 pages);  doi:10.1115/1.4039137

Journal of Electronic Packaging  |  research-article
2018
David Eric Schwartz, Clinton J. Smith, Joseph Lee, Shakthi Priya Gowri, George Daniel, Christopher Lalau-Keraly, Quentin Baudenon and J. R. M. Saavedra
J. Electron. Packag 140, 020904 (2018) (5 pages);  doi:10.1115/1.4039138

Journal of Electronic Packaging  |  research-article
2018
Tingting Zhang, Bahgat Sammakia, Zhihao Yang and Howard Wang
J. Electron. Packag , (2018);  doi:10.1115/1.4040204

Basic Principles and Potential Applications of Holographic Microwave Imaging  |  Paper
2016
Basic Principles and Potential Applications of Holographic Microwave Imaging Front Matter (2016) (10 pages);  doi:10.1115/1.860434_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
OPEN ACCESS Front Matter
Thermal Management of Microelectronic Equipment, Second Edition Front Matter (2016) (30 pages);  doi:10.1115/1.861097_fm

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Introduction (2016) (14 pages);  doi:10.1115/1.861097_ch1

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Radiation (2016) (14 pages);  doi:10.1115/1.861097_ch4

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Thermal Interface Resistance (2016) (28 pages);  doi:10.1115/1.861097_ch9

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Component and Printed Circuit Board (2016) (16 pages);  doi:10.1115/1.861097_ch10

Thermal Management of Microelectronic Equipment, Second Edition  |  Paper
2016
Thermal Management of Microelectronic Equipment, Second Edition Microwave Modules and GaAs Chips (2016) (38 pages);  doi:10.1115/1.861097_ch18

Advances in Computers and Information in Engineering Research, Volume 1  |  Chapter 3
2014
Hammad Mazhar, Toby Heyn, Daniel Melanz, Arman Pazouki, Aaron Bartholomew, Dan Negrut, Paramsothy Jayakumar and Alessandro Tasora
Advances in Computers and Information in Engineering Research, Volume 1 Accelerating Multi-Body Simulation and Visualization with GPU Computing (2014) (25 pages);  doi:10.1115/1.860328_ch3

Thermal Management of Telecommunications Equipment  |  Chapter 1
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Introduction (2013) (4 pages);  doi:10.1115/1.860205_ch1

Thermal Management of Telecommunications Equipment  |  Chapter 2
2013
Lian-Tuu Yeh and Richard C. Chu
Thermal Management of Telecommunications Equipment Component and Printed Circuit Board (2013) (16 pages);  doi:10.1115/1.860205_ch2

Volume 5: Education and Globalization
2017
Michael G. Mauk, Richard Y. Chiou, Shraman Kadapa, Yalcin Ertekin and Tzu-Liang (Bill) Tseng
IMECE2017, pp. V005T06A040- (2017) 8 pages
doi:10.1115/IMECE2017-72264

Volume 7: Fluids Engineering
2017
Flávia V. Barbosa, Pedro E. A. Ribeiro, Maria F. Cerqueira, Delfim F. Soares, José C. F. Teixeira, Senhorinha F. C. F. Teixeira, Rui A. M. M. Lima and Diana M. D. Pinho
IMECE2017, pp. V007T09A035- (2017) 10 pages
doi:10.1115/IMECE2017-71413

Volume 8: Heat Transfer and Thermal Engineering
2017
Tadeh Avanessian and Gisuk Hwang
IMECE2017, pp. V008T10A074- (2017) 8 pages
doi:10.1115/IMECE2017-72663

Volume 10: Micro- and Nano-Systems Engineering and Packaging
2017
Akihiro Goryu, Mitsuaki Kato, Akira Kano, Satoshi Izumi and Kenji Hirohata
IMECE2017, pp. V010T13A019- (2017) 8 pages
doi:10.1115/IMECE2017-72027

Volume 14: Emerging Technologies; Materials: Genetics to Structures; Safety Engineering and Risk Analysis
2017
Richard J. Manley, Dennis G. Gallagher, William W. Hughes, III and Allie M. Pilcher
IMECE2017, pp. V014T07A012- (2017) 7 pages
doi:10.1115/IMECE2017-70026

Volume 14: Emerging Technologies; Materials: Genetics to Structures; Safety Engineering and Risk Analysis
2017
Pedro E. Ribeiro, Delfim F. Soares, Maria F. Cerqueira, Senhorinha F. Teixeira, Daniel A. Barros and José C. Teixeira
IMECE2017, pp. V014T11A020- (2017) 7 pages
doi:10.1115/IMECE2017-71532

Volume 2: Emissions Control Systems; Instrumentation, Controls, and Hybrids; Numerical Simulation; Engine Design and Mechanical Development
2017
Jian Gao, Ronald O. Grover, Jr., Venkatesh Gopalakrishnan, Ramachandra Diwakar, Wael Elwasif, K. Dean Edwards, Charles E. A. Finney and Russell Whitesides
ICEF2017, pp. V002T06A025- (2017) 7 pages
doi:10.1115/ICEF2017-3631

Volume 1: Aerospace Applications; Advances in Control Design Methods; Bio Engineering Applications; Advances in Non-Linear Control; Adaptive and Intelligent Systems Control; Advances in Wind Energy Systems; Advances in Robotics; Assistive and Rehabilitation Robotics; Biomedical and Neural Systems Modeling, Diagnostics, and Control; Bio-Mechatronics and Physical Human Robot; Advanced Driver Assistance Systems and Autonomous Vehicles; Automotive Systems
2017
Hanie O. Baayoun and Zheng Chen
DSCC2017, pp. V001T25A003- (2017) 8 pages
doi:10.1115/DSCC2017-5078

Volume 2: Mechatronics; Estimation and Identification; Uncertain Systems and Robustness; Path Planning and Motion Control; Tracking Control Systems; Multi-Agent and Networked Systems; Manufacturing; Intelligent Transportation and Vehicles; Sensors and Actuators; Diagnostics and Detection; Unmanned, Ground and Surface Robotics; Motion and Vibration Control Applications
2017
Jeremy J. Dawkins
DSCC2017, pp. V002T04A006- (2017) 5 pages
doi:10.1115/DSCC2017-5273

Volume 2: Mechatronics; Estimation and Identification; Uncertain Systems and Robustness; Path Planning and Motion Control; Tracking Control Systems; Multi-Agent and Networked Systems; Manufacturing; Intelligent Transportation and Vehicles; Sensors and Actuators; Diagnostics and Detection; Unmanned, Ground and Surface Robotics; Motion and Vibration Control Applications
2017
Pratap Bhanu Solanki and Xiaobo Tan
DSCC2017, pp. V002T04A009- (2017) 10 pages
doi:10.1115/DSCC2017-5344

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